參數(shù)資料
型號(hào)： TPS62304YZD
廠商： Texas Instruments, Inc.
英文描述： 500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING
中文描述： 500毫安，3 MHz的同步降壓轉(zhuǎn)換器芯片級(jí)封裝
文件頁(yè)數(shù)： 22/37頁(yè)
文件大?。?/td> 1299K
代理商： TPS62304YZD
www.ti.com
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependant issues such as thermal coupling, airflow, added
heat sinks, and convection surfaces, and the presence of other heat-generating components, affect the
power-dissipation limits of a given component
PD(MAX)
TJ(MAX)
TA
RJA
125
°
C
250
°
C W
85
°
C
160 mW
(6)
CHIP SCALE PACKAGE DIMENSIONS
The TPS6230x, TPS6231x, and TPS6232x are also available in an 8-bump chip scale package (YZD, YZ
NanoFree and YED, NanoStar). The package dimensions are given as:
D = 1.970 ±0.05 mm
E = 0.970 ±0.05 mm
TPS62300, TPS62301, TPS62302
TPS62303, TPS62304, TPS62305,
TPS62311, TPS62313, TPS62315, TPS62320, TPS62321
SLVS528E–JULY 2004–REVISED NOVEMBER 2007
Three basic approaches for enhancing thermal performance are listed below:
Improving the power dissipation capability of the PCB design
Improving the thermal coupling of the component to the PCB
Introducing airflow in the system
The maximum recommended junction temperature (T
J
) of the TPS6230x, TPS6231x, and TPS6232x devices is
125
°
C. The thermal resistance of the 8-pin CSP package (YZD, YZ and YED) is R
θ
JA
= 250
°
C/W. Specified
regulator operation is specified to a maximum ambient temperature T
A
of 85
°
C. Therefore, the maximum power
dissipation is about 160 mW. More power can be dissipated if the maximum ambient temperature of the
application is lower, or if the PowerPAD package (DRC) is used.
22
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Copyright 2004–2007, Texas Instruments Incorporated
Product Folder Link(s):
TPS62300, TPS62301, TPS62302 TPS62303, TPS62304, TPS62305, TPS62311, TPS62313,
TPS62315, TPS62320, TPS62321
相關(guān)PDF資料
PDF描述
TPS62315YZ 500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING
TPS62320YZD 500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING
TPS62300DRC 500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING
TPS62300YZD 500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING
TPS62301DRC 500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TPS62304YZDR 功能描述:直流/直流開關(guān)調(diào)節(jié)器 1.2V 500-mA 3-MHz Step-Down Converter RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關(guān)頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5
TPS62304YZDT 功能描述:直流/直流開關(guān)調(diào)節(jié)器 1.2V 500-mA 3-MHz Step-Down Converter RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關(guān)頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5
TPS62305DRCR 功能描述:直流/直流開關(guān)調(diào)節(jié)器 1.875V 500-mA 3-MHz Step-Down Converter RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關(guān)頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5
TPS62305DRCRG4 功能描述:直流/直流開關(guān)調(diào)節(jié)器 1.875V 500-mA 3-MHz Step-Down Converter RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關(guān)頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5
TPS62305YZDR 功能描述:直流/直流開關(guān)調(diào)節(jié)器 1.875V 500-mA 3-MHz Step-Down Converter RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關(guān)頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5
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