參數(shù)資料
型號: TPS54316PWPR
英文描述: Analog IC
中文描述: 模擬IC
文件頁數(shù): 15/16頁
文件大?。?/td> 260K
代理商: TPS54316PWPR
TPS54611, TPS54612, TPS54613
TPS54614, TPS54615, TPS54616
SLVS400A
AUGUST 2001
REVISED JANUARY 2002
15
www.ti.com
MECHANICAL DATA
PWP (R-PDSO-G**)
PowerPAD
PLASTIC SMALL-OUTLINE
4073225/F 10/98
0,50
0,75
0,25
0,15 NOM
Thermal Pad
(See Note D)
Gage Plane
28
24
7,70
7,90
20
6,40
6,60
9,60
9,80
6,60
6,20
11
0,19
4,50
4,30
10
0,15
0,05
20
A
1
0,30
1,20 MAX
16
14
5,10
4,90
PINS **
4,90
5,10
DIM
A MIN
A MAX
Seating Plane
0,65
0,10
M
0,10
0
°
8
°
20 PINS SHOWN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusions.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-153
PowerPAD is a trademark of Texas Instruments.
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