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參數(shù)資料
| 型號(hào)： | TPA751GQS |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 0.7 W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA24 |
| 封裝： | 3 X3 MM, PLASTIC, BGA-24 |
| 文件頁數(shù)： | 1/32頁 |
| 文件大?。?/td> | 910K |
| 代理商： | TPA751GQS |
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TPA751
700mW MONO LOW VOLTAGE AUDIO POWER AMPLIFIER
WITH DIFFERENTIAL INPUTS
SLOS336C DECEMBER 2000 REVISED OCTOBER 2002
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Fully Specified for 3.3-V and 5-V Operation
D Wide Power Supply Compatibility
2.5 V 5.5 V
D Power Supply Rejection at 217 Hz
84 dB at VDD = 5 V
81 dB at VDD = 3.3 V
D Output Power for RL = 8
700 mW at VDD = 5 V
250 mW at VDD = 3.3 V
D Ultralow Supply Current in Shutdown
Mode . . . 1.5 nA
D Thermal and Short-Circuit Protection
D Surface-Mount Packaging
SOIC
PowerPAD
MSOP
MicroStar Junior
(BGA)
description
The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications
where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of
continuous power into a BTL 8-
load at less than 0.6% THD+N throughout voice band frequencies. Although
this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as
wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the
output in most applications, which is particularly important for small battery-powered equipment. This device
features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown.
The TPA751 is available in a 3.0
× 3.0 mm MicroStar Junior (BGA), 8-pin SOIC surface-mount package and
a surface-mount PowerPAD
MSOP.
Audio
Input
Bias
Control
VDD
700 mW
6
5
7
VO+
VDD
1
2
4
BYPASS
IN
VDD/2
CI
RI
CS
CB
RF
SHUTDOWN
VO8
GND
From System Control
3
IN+
+
+
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright
2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
2
3
4
8
7
6
5
SHUTDOWN
BYPASS
IN+
IN
VO
GND
VDD
VO+
D OR DGN PACKAGE
(TOP VIEW)
(SIDE VIEW)
MicroStar Junior
t (GQS) Package
(TOP VIEW)
SHUTDOWN
VO
BYPASS
IN+
IN
GND
VDD
VO+
NOTE: The shaded terminals are used for thermal
connections to the ground plane.
(E2)
(E3)
(E4)
(E5)
(A2)
(A3)
(A4)
(A5)
PowerPAD and MicroStar Junior are trademarks of Texas Instruments.
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| TPA-B-20 | 功能描述:保險(xiǎn)絲 TELPOWER ALARM FUSE RoHS:否 制造商:Littelfuse 產(chǎn)品:Surface Mount Fuses 電流額定值:0.5 A 電壓額定值:600 V 保險(xiǎn)絲類型:Fast Acting 保險(xiǎn)絲大小/組:Nano 尺寸:12.1 mm L x 4.5 mm W 安裝風(fēng)格: 端接類型:SMD/SMT 系列:485 |
| TPA-B-25 | 功能描述:保險(xiǎn)絲 TELPOWER ALARM FUSE RoHS:否 制造商:Littelfuse 產(chǎn)品:Surface Mount Fuses 電流額定值:0.5 A 電壓額定值:600 V 保險(xiǎn)絲類型:Fast Acting 保險(xiǎn)絲大小/組:Nano 尺寸:12.1 mm L x 4.5 mm W 安裝風(fēng)格: 端接類型:SMD/SMT 系列:485 |
| TPA-B-30 | 功能描述:保險(xiǎn)絲 TELPOWER ALARM FUSE RoHS:否 制造商:Littelfuse 產(chǎn)品:Surface Mount Fuses 電流額定值:0.5 A 電壓額定值:600 V 保險(xiǎn)絲類型:Fast Acting 保險(xiǎn)絲大小/組:Nano 尺寸:12.1 mm L x 4.5 mm W 安裝風(fēng)格: 端接類型:SMD/SMT 系列:485 |
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