參數資料
型號: TPA701DR
元件分類: 運動控制電子
英文描述: Single Audio Amplifier
中文描述: 單音頻放大器
文件頁數: 2/22頁
文件大?。?/td> 393K
代理商: TPA701DR
TPA701
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229B – NOVEMBER1998 – REVISED MARCH 2000
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
AVAILABLE OPTIONS
PACKAGED DEVICES
SMALL OUTLINE
(D)
MSOP
TA
MSOP
(DGN)
SYMBOLIZATION
–40
°
C to 85
°
C
In the SOIC package, the maximum RMS output power is thermally limited to 350 mW; 700 mW
peaks can be driven, as long as the RMS value is less than 350 mW.
The D and DGN packages are available taped and reeled. To order a taped and reeled part, add
the suffix R to the part number (e.g., TPA701DR).
TPA701D
TPA701DGN
ABA
Terminal Functions
TERMINAL
NAME
I/O
DESCRIPTION
NO.
BYPASS
2
I
BYPASS is the tap to the voltage divider for internal mid-supply bias. This terminal should be connected to
a 0.1-
μ
F to 2.2-
μ
F capacitor when used as an audio amplifier.
GND
7
GND is the ground connection.
IN–
4
I
IN– is the inverting input. IN– is typically used as the audio input terminal.
IN+
3
I
IN+ is the noninverting input. IN+ is typically tied to the BYPASS terminal.
SHUTDOWN places the entire device in shutdown mode when held high (IDD = 1.5
nA).
VDD is the supply voltage terminal.
VO+ is the positive BTL output.
VO– is the negative BTL output.
SHUTDOWN
1
I
VDD
VO+
VO–
6
5
O
8
O
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
§
Supply voltage, V
DD
Input voltage, V
I
Continuous total power dissipation
Operating free-air temperature range, T
A
Operating junction temperature range, T
J
Storage temperature range, T
stg
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
internally limited (see Dissipation Rating Table)
. . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–0.3 V to V
DD
+0.3 V
–40
°
C to 85
°
C
–40
°
C to 150
°
C
–65
°
C to 150
°
C
260
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
§Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE
TA
25
°
C
725 mW
2.14 W
DERATING FACTOR
5.8 mW/
°
C
TA = 70
°
C
464 mW
TA = 85
°
C
377 mW
D
DGN
17.1 mW/
°
C
1.37 W
1.11 W
Please see the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report
(literature number SLMA002), for more information on the PowerPAD package. The thermal data was
measured on a PCB layout based on the information in the section entitled Texas Instruments Recommended
Board for PowerPADon page 33 of the before mentioned document.
recommended operating conditions
MIN
MAX
UNIT
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Operating free-air temperature, TA
2.5
5.5
V
°
C
–40
85
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