參數(shù)資料
型號(hào)： TPA2014D1YZHT
廠商： TEXAS INSTRUMENTS INC
元件分類： 音頻／視頻放大
英文描述： 1.5 W, 1 CHANNEL, AUDIO AMPLIFIER, BGA16
封裝： 2.275 X 2.275 MM, GREEN, DSBGA-16
文件頁(yè)數(shù)： 12/27頁(yè)
文件大小： 945K
代理商： TPA2014D1YZHT
DEVICE INFORMATION
V
CCFB
SW
V
C
OUT
V
C
IN
SDb
IN+
IN–
PGND
SDd
V
DD
PGND
RGP (QFN)Package
(TopView)
1
5
6
10
11
15
16
20
GAIN
AGND
VOUT–
VOUT+
V
CCFB
SW
V
CCOUT
V
CCIN
SDb
IN+
IN–
PGND
AGND
SDd
PGND
VOUT–
V
DD
GAIN
VOUT+
PGND
D1
D2
D3
D4
C1
C2
C3
C4
B1
B3
B4
B2
A1
A2
A3
A4
YZH (WCSP)Package
(TopView)
SLAS559A – MAY 2008 – REVISED JUNE 2008 ............................................................................................................................................................... www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
BOOST CONVERTER TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NAME
QFN
WCSP
IN+
8
D2
I
Positive audio input
IN–
7
D3
I
Negative audio input
VOUT+
13, 14, 15
B1
O
Positive audio output
VOUT–
11, 12
C1
O
Negative audio output
SDb
6
D4
I
Shutdown terminal for the Boost Converter
SDd
5
C3
I
Shutdown terminal for the Class D Amplifier
SW
18, 19
A3
–
Boost and rectifying switch input
VCCOUT
17
A2
–
Boost converter output - connect to VCCIN
GAIN
3
B2
I
Gain selection pin
VCCIN
16
A1
–
Class-D audio power amplifier voltage supply - connect to VCCOUT
VCCFB
2
B3
I
Voltage feedback
VDD
1
B4
–
Supply voltage
AGND
4
C4
–
Analog ground - connect all GND pins together
PGND
9, 10, 20
D1, C2, A4
–
Power ground - connect all GND pins together
Thermal
Solder the thermal pad on the bottom of the QFN package to the GND plane of the PCB.
Die Pad
N/A
P
Pad
It is required for mechanical stability and will enhance thermal performance.
2
Copyright 2008, Texas Instruments Incorporated
Product Folder Link(s): TPA2014D1
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