參數(shù)資料
型號(hào)： TPA2013D1RGP
廠商： TEXAS INSTRUMENTS INC
元件分類(lèi)： 音頻／視頻放大
英文描述： 2.7 W, 2 CHANNEL, AUDIO AMPLIFIER, PQCC20
封裝： 4 X 4 MM, PLASTIC, QFN-20
文件頁(yè)數(shù)： 14/30頁(yè)
文件大?。?/td> 949K
代理商： TPA2013D1RGP
www.ti.com
A
J
JA Dmax
T Max = T Max
P
= 150
80.64 (0.317) = 124 C
- q
-
°
(9)
BOARD LAYOUT
Copper TraceWidth
Solder PadWidth
SolderMask Opening
Copper Trace Thickness
SolderMask Thickness
SLOS520 – AUGUST 2007
Equation 9 shows that the calculated maximum ambient temperature is 124
°C at maximum power dissipation
under the above conditions. The TPA2013D1 is designed with thermal protection that turns the device off when
the junction temperature surpasses 150
°C to prevent damage to the IC. Also, using speakers more resistive than
4-
dramatically increases the thermal performance by reducing the output current and increasing the efficiency
of the amplifier.
In making the pad size for the WCSP balls, use nonsolder mask defined (NSMD) land. With this method, the
solder mask opening is made larger than the desired land area, and the opening size is defined by the copper
pad width. Figure 35 and Table 5 show the appropriate diameters for a WCSP layout.
Figure 35. Land Pattern Dimensions
Table 5. Land Pattern Dimensions
SOLDER PAD
SOLDER MASK
COPPER
STENCIL
COPPER PAD
DEFINITIONS
OPENING
THICKNESS
OPENING
THICKNESS
Nonsolder mask
275
μm
375
μm
1 oz max (32
μm)
275
μm x 275 μm Sq.
125
μm thick
defined (NSMD)
(+0.0, –25
μm)
(+0.0, –25
μm)
(rounded corners)
NOTES:
1. Circuit traces from NSMD defined PWB lands should be 75
μm to 100 μm wide in the exposed area inside
the solder mask opening. Wider trace widths reduce device stand off and impact reliability.
2. Recommend solder paste is Type 3 or Type 4.
3. Best reliability results are achieved when the PWB laminate glass transition temperature is above the
operating the range of the intended application.
4. For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in
thermal fatigue performance.
5. Solder mask thickness should be less than 20
μm on top of the copper circuit pattern.
6. Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically
etched stencils results in inferior solder paste volume control.
7. Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional
component movement due to solder wetting forces.
Copyright 2007, Texas Instruments Incorporated
21
Product Folder Link(s): TPA2013D1
相關(guān)PDF資料
PDF描述
TPA2013D1RGPT 2.7 W, 2 CHANNEL, AUDIO AMPLIFIER, PQCC20
TPA2013D1YZHT 2.7 W, 1 CHANNEL, AUDIO AMPLIFIER, BGA16
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TPA2013D1RGPR 功能描述:音頻放大器 2.7W Constant Output Pwr Mono Class-D RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA2013D1RGPRG4 功能描述:音頻放大器 2.7W Constant Output Pwr Mono Class-D RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA2013D1RGPT 制造商:Texas Instruments 功能描述:AUD AMP SPKR 1CH MONO 2.7W CLS-D 20QFN - Tape and Reel
TPA2013D1YZH 制造商:TI 制造商全稱(chēng):Texas Instruments 功能描述:2.7-W CONSTANT OUTPUT POWER CLASS-D AUDIO AMPLIFIER WITH INTEGRATED BOOST CONVERTER
TPA2013D1YZHR 功能描述:音頻放大器 2.7W OUTPUT PWR MONO CLASS-D AUD AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
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