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參數(shù)資料
| 型號： | TPA2013D1_1 |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | 2.7-W CONSTANT OUTPUT POWER CLASS-D AUDIO AMPLIFIER WITH INTEGRATED BOOST CONVERTER |
| 中文描述： | 2.7鎢恒定輸出功率D類音頻放大器，具有集成升壓轉(zhuǎn)換器 |
| 文件頁數(shù)： | 21/30頁 |
| 文件大?。?/td> | 900K |
| 代理商： | TPA2013D1_1 |
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www.ti.com
JA Dmax
- q
T Max = T Max
= 150
80.64 (0.317) = 124 C
-
°
(9)
BOARD LAYOUT
In making the pad size for the WCSP balls, use nonsolder mask defined (NSMD) land. With this method, the
solder mask opening is made larger than the desired land area, and the opening size is defined by the copper
pad width.
Figure 35
and
Table 5
show the appropriate diameters for a WCSP layout.
Copper Trace Width
Solder Pad Width
Solder Mask Opening
Copper Trace Thickness
Solder Mask Thickness
TPA2013D1
SLOS520–AUGUST 2007
Equation 9
shows that the calculated maximum ambient temperature is 124
°
C at maximum power dissipation
under the above conditions. The TPA2013D1 is designed with thermal protection that turns the device off when
the junction temperature surpasses 150
°
C to prevent damage to the IC. Also, using speakers more resistive than
4-
dramatically increases the thermal performance by reducing the output current and increasing the efficiency
of the amplifier.
Figure 35. Land Pattern Dimensions
Table 5. Land Pattern Dimensions
SOLDER PAD
DEFINITIONS
Nonsolder mask
defined (NSMD)
SOLDER MASK
OPENING
375
μ
m
(+0.0, –25
μ
m)
COPPER
THICKNESS
1 oz max (32
μ
m)
STENCIL
OPENING
STENCIL
THICKNESS
125
μ
m thick
COPPER PAD
275
μ
m
(+0.0, –25
μ
m)
275
μ
m x 275
μ
m Sq.
(rounded corners)
NOTES:
1. Circuit traces from NSMD defined PWB lands should be 75
μ
m to 100
μ
m wide in the exposed area inside
the solder mask opening. Wider trace widths reduce device stand off and impact reliability.
2. Recommend solder paste is Type 3 or Type 4.
3. Best reliability results are achieved when the PWB laminate glass transition temperature is above the
operating the range of the intended application.
4. For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in
thermal fatigue performance.
5. Solder mask thickness should be less than 20
μ
m on top of the copper circuit pattern.
6. Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically
etched stencils results in inferior solder paste volume control.
7. Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional
component movement due to solder wetting forces.
Copyright 2007, Texas Instruments Incorporated
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TPA2013D1
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TPA2013D1EVM | 功能描述:音頻 IC 開發(fā)工具 TPA2013D1EVM Eval Mod RoHS:否 制造商:Texas Instruments 產(chǎn)品:Evaluation Kits 類型:Audio Amplifiers 工具用于評估:TAS5614L 工作電源電壓:12 V to 38 V |
| TPA2013D1RGP | 制造商:TI 制造商全稱:Texas Instruments 功能描述:2.7-W CONSTANT OUTPUT POWER CLASS-D AUDIO AMPLIFIER WITH INTEGRATED BOOST CONVERTER |
| TPA2013D1RGPR | 功能描述:音頻放大器 2.7W Constant Output Pwr Mono Class-D RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TPA2013D1RGPRG4 | 功能描述:音頻放大器 2.7W Constant Output Pwr Mono Class-D RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TPA2013D1RGPT | 制造商:Texas Instruments 功能描述:AUD AMP SPKR 1CH MONO 2.7W CLS-D 20QFN - Tape and Reel |
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