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參數資料
| 型號： | TPA2012D2YZHR |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 2.1 W, 2 CHANNEL, AUDIO AMPLIFIER, BGA16 |
| 封裝： | 2.01 X 2.01 MM, GREEN, DSBGA-16 |
| 文件頁數： | 5/22頁 |
| 文件大小： | 785K |
| 代理商： | TPA2012D2YZHR |
BOARD LAYOUT
Copper
Trace Width
Solder Mask
Thickness
Solder
Pad Width
Solder Mask
Opening
Copper Trace
Thickness
Component Location
www.ti.com .................................................................................................................................................. SLOS438D – DECEMBER 2004 – REVISED JUNE 2008
In making the pad size for the WCSP balls, it is recommended that the layout use nonsolder mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 36 and Table 2 shows the appropriate diameters for a
WCSP layout. The TPA2012D2 evaluation module (EVM) layout is shown in the next section as a layout
example.
Figure 36. Land Pattern Dimensions
Table 2. Land Pattern Dimensions(1)(2)(3)(4)
SOLDER PAD
COPPER
SOLDER MASK (5)
COPPER
STENCIL (6)(7)
STENCIL
DEFINITIONS
PAD
OPENING
THICKNESS
OPENING
THICKNESS
Nonsolder mask
275
m
275
m x 275 m Sq.
375
m (+0.0, -25 m)
1 oz max (32
m)
125
m thick
defined (NSMD)
(+0.0, -25
m)
(rounded corners)
(1)
Circuit traces from NSMD defined PWB lands should be 75
m to 100 m wide in the exposed area inside the solder mask opening.
Wider trace widths reduce device stand off and impact reliability.
(2)
Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the
intended application.
(3)
Recommend solder paste is Type 3 or Type 4.
(4)
For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in thermal fatigue performance.
(5)
Solder mask thickness should be less than 20
m on top of the copper circuit pattern
(6)
Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in
inferior solder paste volume control.
(7)
Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to
solder wetting forces.
Place all the external components very close to the TPA2012D2. Placing the decoupling capacitor, CS, close to
the TPA2012D2 is important for the efficiency of the Class-D amplifier. Any resistance or inductance in the trace
between the device and the capacitor can cause a loss in efficiency.
Copyright 2004–2008, Texas Instruments Incorporated
13
Product Folder Link(s): TPA2012D2
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| TPA2012D2YZHT | 功能描述:音頻放大器 2.1W Stereo Class-D Aud Power Amplifier RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TPA2013D1 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:2.7-W CONSTANT OUTPUT POWER CLASS-D AUDIO AMPLIFIER WITH INTEGRATED BOOST CONVERTER |
| TPA2013D1_1 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:2.7-W CONSTANT OUTPUT POWER CLASS-D AUDIO AMPLIFIER WITH INTEGRATED BOOST CONVERTER |
| TPA2013D1EVM | 功能描述:音頻 IC 開發(fā)工具 TPA2013D1EVM Eval Mod RoHS:否 制造商:Texas Instruments 產品:Evaluation Kits 類型:Audio Amplifiers 工具用于評估:TAS5614L 工作電源電壓:12 V to 38 V |
| TPA2013D1RGP | 制造商:TI 制造商全稱:Texas Instruments 功能描述:2.7-W CONSTANT OUTPUT POWER CLASS-D AUDIO AMPLIFIER WITH INTEGRATED BOOST CONVERTER |
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