參數(shù)資料
型號(hào)： TPA2005D1ZQYRQ1
廠商： TEXAS INSTRUMENTS INC
元件分類(lèi)： 音頻／視頻放大
英文描述： 1.45 W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA
封裝： 2.5 X 2.5 MM, LEAD FREE
文件頁(yè)數(shù)： 7/29頁(yè)
文件大?。?/td> 1192K
代理商： TPA2005D1ZQYRQ1
BOARD LAYOUT
Component Location
Trace Width
MicroStar Junior BGA Layout
0,28
mm
0,38
mm
0,25
mm
SD
NC
IN+
IN
GND
VDD
Vo+
Vo
Solder Mask
Paste Mask
Copper Trace
8-Pin QFN (DRB) Layout
www.ti.com............................................................................................................................................. SLOS474B – AUGUST 2005 – REVISED DECEMBER 2008
Place all the external components very close to the TPA2005D1. The input resistors need to be very close to the
TPA2005D1 input pins so noise does not couple on the high-impedance nodes between the input resistors and
the input amplifier of the TPA2005D1. Placing the decoupling capacitor, CS, close to the TPA2005D1 is important
for the efficiency of the class-D amplifier. Any resistance or inductance in the trace between the device and the
capacitor can cause a loss in efficiency.
Make the high current traces going to pins VDD, GND, VO+ and VO– of the TPA2005D1 have a minimum width of
0,7 mm. If these traces are too thin, the TPA2005D1 performance and output power will decrease. The input
traces do not need to be wide, but do need to run side-by-side to enable common-mode noise cancellation.
Use the following MicroStar Junior BGA ball diameters:
0,25 mm diameter solder mask
0,28 mm diameter solder paste mask/stencil
0,38 mm diameter copper trace
Figure 32 shows how to lay out a board for the TPA2005D1 MicroStar Junior BGA.
Figure 32. TPA2005D1 MicroStar Junior BGA Board Layout (Top View)
Use the following land pattern for board layout with the 8-pin QFN (DRB) package. Note that the solder paste
should use a hatch pattern to fill solder paste at 50% to ensure that there is not too much solder paste under the
package.
Copyright 2005–2008, Texas Instruments Incorporated
15
Product Folder Link(s): TPA2005D1-Q1
相關(guān)PDF資料
PDF描述
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TPA2006D1 制造商:TI 制造商全稱:Texas Instruments 功能描述:1.45-W MONO FILTER-FREE CLASS-D AUDIO POWER AMPLIFIER WITH 1.8-V COMPATIBLE INPUT THRESHOLDS
TPA2006D1DRB 制造商:TI 制造商全稱:Texas Instruments 功能描述:1.45-W MONO FILTER-FREE CLASS-D AUDIO POWER AMPLIFIER WITH 1.8-V COMPATIBLE INPUT THRESHOLDS
TPA2006D1DRBR 功能描述:音頻放大器 1.45W Mono Fil-Free Class-D Audio Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA2006D1DRBRG4 功能描述:音頻放大器 1.45W Mono Fil-Free Class-D Audio Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA2006D1DRBT 功能描述:音頻放大器 1.45W Mono Fil-Free Class-D Audio Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
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