TPA2000D4
STEREO 2-W CLASS-D AUDIO POWER AMPLIFIER
WITH STEREO HP AMPLIFIER
SLOS337 – DECEMBER 2000
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Ideal for Notebook PCs and USB-Powered
Speakers
D 2 W Into 4 From 5-V Supply
D Integrated Class-AB Headphone Amplifier
D Second-Generation Modulation Technique
– Filterless Operation
– Improved Efficiency
D Low Supply Current ...9 mA typ at 5 V
D Shutdown Control ...< 0.05 A Typ
D Shutdown Pin Is TTL Compatible
D –40°C to 85°C Operating Temperature
Range
D Space-Saving, Thermally-Enhanced
MicroStar
BGA{ and PowerPAD
Packaging
description
The TPA2000D4 is a 2-W stereo bridge-tied-load
(BTL)
class-D
amplifier
designed
to
drive
speakers with as low as 4-
impedance. The amplifier uses TI’s second-generation modulation technique,
which results in improved efficiency and SNR, and also allows the device to be connected directly to the speaker
without the use of the LC output filter commonly associated with class-D amplifiers (this will result in an EMI
which must be shielded at the system level). These features make the device ideal for use in notebook PCs
where high-efficiency is needed to extend battery run-time. For speakers powered off the USB bus, the
high-efficiency allows for higher output power levels without tripping the USB’s over-current circuitry.
The gain of the amplifier is controlled by two input terminals, GAIN1, and GAIN0. This allows the amplifier to
be configured for a gain of 5, 11, 17 and 23 dB. The differential input terminals are high-impedance CMOS
inputs, and can be used as summing nodes.
The headphone amplifier is a stereo single-ended (SE) class-AB amplifier which requires two external resistors
per channel to set the gain. The MODE pin selects which amplifier is active; the unused amplifier is placed in
shutdown to reduce supply current.
Both the class-D BTL amplifier, and the class-AB SE amplifier include depop circuitry to reduce the amount of
turnon pop at power up, when cycling SHUTDOWN, and when switching modes of operation.
The TPA2000D4 is available in the 32-pin thermally-enhanced TSSOP package (DAP) and TI’s new MicroStar
BGA package which is thermally-enhanced to allow stereo 2-W continuous output power levels in 4-
loads
when placed on a board with proper thermal board design. The TPA2000D4 operates over an ambient
temperature range of –40
°C to 85°C.
These thermally-enhanced packages deliver levels of thermal performance that were previously only
achievable in TO-220-type packages. Thermal impedances of less than 35
°C/W are readily realized in
multilayer PCB applications when using the DAP package.
Copyright
2000, Texas Instruments Incorporated
This document contains information on products in more than one phase
of development. The status of each device is indicated on the page(s)
specifying its electrical characteristics.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
This package is in the PRODUCT PREVIEW stage of development.
MicroStar and PowerPAD are trademarks of Texas Instruments.
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LINN
LINP
HPLIN
GAIN0
GAIN1
PVDDL
LOUTP
PGNDL
LOUTN
PVDDL
HPLGAIN
HPLOUT
MODE
HPRGAIN
HPROUT
RINN
RINP
HPRIN
BYPASS
SHUTDOWN
PVDDR
ROUTP
PGNDR
ROUTN
PVDDR
NC
VDD
COSC
ROSC
AGND
DAP PACKAGE
(TOP VIEW)
NC – No internal connection