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參數(shù)資料
| 型號(hào)： | TP13067BDW |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | Codec |
| 英文描述： | MONOLITHIC SERIAL INTERFACE COMBINED PCM CODEC AND FILTER |
| 中文描述： | 整體式串行接口的PCM編解碼器和過濾器 |
| 文件頁數(shù)： | 14/21頁 |
| 文件大小： | 300K |
| 代理商： | TP13067BDW |
TP3064B, TP3067B, TP13064B, TP13067B
MONOLITHIC SERIAL INTERFACE
COMBINED PCMCODEC AND FILTER
SCTS031D – MAY 1990 –REVISED JULY 1996
14
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
PRINCIPLES OF OPERATION
system reliability and design considerations
TP306xB, TP1306xB system reliability and design considerations are detailed in the following paragraphs.
latch-up
Latch-up is possible in all CMOS devices. It is caused by the firing of a parasitic SCR that is present due to the
inherent nature of CMOS. When a latch-up occurs, the device draws excessive amounts of current and will
continue to draw heavy current until power is removed. Latch-up can result in permanent damage to the device
if supply current to the device is not limited.
Even though the TP306xB and TP1306xB devices are heavily protected against latch-up, it is still possible to
cause latch-up under certain conditions in which excess current is forced into or out of one or more terminals.
Latch-up can occur when the positive supply voltage drops momentarily below ground, when the negative
supply voltage rises momentarily above ground, or possibly if a signal is applied to a terminal after power has
been applied but before the ground is connected. This can happen if the device is hot-inserted into a card with
the power applied, or if the device is mounted on a card with an edge connector, and the card is hot-inserted
into a system with the power on.
To help ensure that latch-up does not occur, it is considered good design practice to connect a reversed biased
Schottky diode (with a forward voltage drop of less than or equal to 0.4 V — 1N5711 or equivalent), between
each power supply and GND (see Figure 3). If it is possible that a TP306xB- or TP1306xB-equipped card that
has an edge connector could be hot-inserted into a powered-up system, it is also important to ensure that the
ground edge connector traces are longer than the power and signal traces so that the card ground is always
the first to make contact.
device power-up sequence
Latch-up can also occur if a signal source is connected without the device being properly grounded. A signal
applied to one terminal could then find a ground through another signal terminal on the device. To ensure proper
operation of the device and as a safeguard against this sort of latch-up, it is recommended the following
power-up sequence always be used:
1.
Ensure no signals are applied to the device before the power-up sequence is complete.
2.
Connect GND.
3.
Apply V
BB
(most negative voltage).
Apply V
CC
(most positive voltage).
Force a power down condition in the device.
4.
5.
6.
Connect clocks.
7.
Release power down condition.
8.
Apply FSX and/or FXR synchronization pulses.
9.
Apply signal inputs.
When powering down the device, this procedure should be followed in the reverse order.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TP3067BN | MONOLITHIC SERIAL INTERFACE COMBINED PCM CODEC AND FILTER |
| TP13067BN | MONOLITHIC SERIAL INTERFACE COMBINED PCM CODEC AND FILTER |
| TP3064B | MONOLITHIC SERIAL INTERFACE COMBINED PCM CODEC AND FILTER |
| TP3064BDW | MONOLITHIC SERIAL INTERFACE COMBINED PCM CODEC AND FILTER |
| TP3064BN | MONOLITHIC SERIAL INTERFACE COMBINED PCM CODEC AND FILTER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TP13067BJ | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:A-Law CODEC |
| TP13067BN | 功能描述:接口—CODEC PCM CODEC RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel |
| TP130K | 功能描述:鉗型萬用表及配件 AIR/GAS K TYPE PROBE RoHS:否 制造商:Fluke 準(zhǔn)確性:2 % 測(cè)距:400 A |
| TP130KA | 功能描述:測(cè)試探頭 AIR/GAS PROBE K TYPE RoHS:否 制造商:Teledyne LeCroy 設(shè)備類型:Passive Probes 帶寬:500 MHz 尖端類型: 長度:1.3 mm 顏色:Black 電壓額定值: 電流額定值: |
| TP1311 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog IC |
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