參數(shù)資料
型號: TOP234P
英文描述: Analog IC
中文描述: 模擬IC
文件頁數(shù): 20/36頁
文件大?。?/td> 650K
代理商: TOP234P
TOP232-234
20
B
7/01
TOPSwitch-FX
Design Considerations
TOPSwitch-FX
Selection
Selecting the optimum
TOPSwitch
-
FX
depends upon required
maximum output power, efficiency, heat sinking constraints
and cost goals. With the option to externally reduce current
limit, a larger
TOPSwitch
-
FX
may be used for lower power
applications where higher efficiency is needed or minimal heat
sinking is available.
Input Capacitor
The input capacitor must be chosen to provide the minimum
DC voltage required for the
TOPSwitch
-
FX
converter to maintain
regulation at the lowest specified input voltage and maximum
output power. Since
TOPSwitch
-
FX
has a higher DC
than
TOPSwitch-II
, it is possible to use a smaller input capacitor. For
TOPSwitch
-
FX,
a
capacitance of 2
μ
F per watt is usually
sufficient for universal input with an appropriately designed
transformer.
Primary Clamp and Output Reflected Voltage V
A primary clamp is necessary to limit the peak
TOPSwitch
-
FX
drain to source voltage. A Zener clamp (see Figure 26, VR1)
requires few parts and takes up little board space. For good
efficiency, the clamp Zener should be selected to be at least 1.5
times the output reflected voltage V
as this keeps the leakage
spike conduction time short. When using a Zener clamp in a
universal input application, a V
of less than 135 V is
recommended to allow for the absolute tolerances and
temperature variations of the Zener. This will ensure efficient
operation of the clamp circuit and will also keep the maximum
drain voltage below the rated breakdown voltage of the
TOPSwitch
-
FX
MOSFET.
A high V
is required to take full advantage of the wider DC
of
TOPSwitch
-
FX.
An RCD clamp provides tighter clamp
voltage tolerance than a Zener clamp and allows a V
as high
as 165 V. The V
can be further increased in continuous mode
designs up to 185 V by reducing the external current limit as a
function of input line voltage (see Figure 18). The RCD clamp
*Not available
Table 3 (cont). Comparison Between TOPSwitch-II and TOPSwitch-FX.
Function
TOPSwitch-II
TOPSwitch-FX
Figures Advantages
Remote ON/OFF
N/A*
Single transistor
or optocoupler
interface or manual 22, 23,
switch
8, 19,
20, 21,
Fast on/off (cycle by cycle)
Active-on or active-off control
Low consumption in remote off state
Active-on control for fail-safe
Eliminates expensive in-line on/off
switch
Allows processor controlled turn on/
off
Permits shutdown/wake-up of
peripherals via LAN or parallel port
Synchronization to external lower
frequency signal
Starts new switching cycle on
demand
Automatic recovery from thermal
fault
Large hysteresis prevents circuit
board overheating
10% higher power capability due to
tighter tolerance
Greater immunity to arcing as a
result of build-up of dust, debris and
other contaminants
Preformed leads accommodate
large creepage for PCB layout
Easier to meet Safety (UL/VDE)
27
Synchronization
N/A*
Single transistor
or optocoupler
interface
Thermal Shutdown
Latched
Hysteretic (with
70
°
C hysteresis)
Current Limit Tolerance
±
10% (@25
°
C)
±
7% (@25
°
C)
-8% (0
°
C to100
°
C) -4% (0
°
C to 100
°
C)
0.037" / 0.94 mm
0.037" / 0.94 mm
TO-220 0.046" / 1.17 mm
DRAIN Creepage at
0.045" / 1.14 mm
PCB for TO-220
DRAIN
Creepage at
Package
DIP
SMD
0.137" / 3.48 mm
0.137" / 3.48 mm
0.068" / 1.73 mm
0.113" / 2.87 mm
(preformed leads)
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