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Contents
TMS320C6455
Fixed-Point Digital Signal Processor
SPRS276H–MAY 2005–REVISED OCTOBER 2007
1
Features
...................................................
1
1.1
1.2
1.3
Device Overview
.........................................
6
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
Device Configuration
..................................
54
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
System Interconnect
...................................
76
4.1
4.2
4.3
4.4
C64x+ Megamodule
....................................
82
5.1
5.2
5.3
5.4
5.5
5.6
5.7
6
Device Operating Conditions
........................
96
6.1
Absolute Maximum Ratings Over Operating Case
Temperature Range (Unless Otherwise Noted)
.....
96
6.2
6.3
Electrical Characteristics Over Recommended
Ranges of Supply Voltage and Operating Case
Temperature (Unless Otherwise Noted)
............
98
C64x+ Peripheral Information and Electrical
Specifications
.........................................
100
7.1
7.2
Recommended Clock and Control Signal Transition
Behavior
............................................
102
7.3
7.4
Enhanced Direct Memory Access (EDMA3)
Controller
...........................................
104
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12
7.13
7.14
7.15
7.16
7.17
7.18
7.19
7.20
7.21
7.22
Revision History
............................................
245
8
8.1
8.2
ZTZ/GTZ BGA Package (Bottom View)
..............
2
Description
............................................
2
Functional Block Diagram
............................
4
Recommended Operating Conditions
...............
96
2
Device Characteristics
................................
6
CPU (DSP Core) Description
.........................
7
Memory Map Summary
.............................
10
Boot Sequence
......................................
12
Pin Assignments
....................................
15
Signal Groups Description
..........................
19
Terminal Functions
..................................
25
Development
........................................
50
7
Parameter Information
.............................
100
Power Supplies
....................................
102
3
Interrupts
...........................................
119
Reset Controller
....................................
123
PLL1 and PLL1 Controller
.........................
131
PLL2 and PLL2 Controller
.........................
146
DDR2 Memory Controller
..........................
155
External Memory Interface A (EMIFA)
.............
157
I2C Peripheral
......................................
168
Host-Port Interface (HPI) Peripheral
...............
174
Multichannel Buffered Serial Port (McBSP)
........
185
Ethernet MAC (EMAC)
.............................
195
Timers
..............................................
213
Enhanced Viterbi-Decoder Coprocessor (VCP2)
..
215
Enhanced Turbo Decoder Coprocessor (TCP2)
...
216
Peripheral Component Interconnect (PCI)
.........
218
UTOPIA
............................................
225
Serial RapidIO (SRIO) Port
........................
229
General-Purpose Input/Output (GPIO)
.............
241
Emulation Features and Capability
................
243
Device Configuration at Device Reset
..............
54
Peripheral Configuration at Device Reset
...........
56
Peripheral Selection After Device Reset
............
58
Device State Control Registers
.....................
60
Device Status Register Description
.................
70
JTAG ID (JTAGID) Register Description
............
72
Pullup/Pulldown Resistors
...........................
73
Configuration Examples
.............................
74
4
Internal Buses, Bridges, and Switch Fabrics
........
76
Data Switch Fabric Connections
....................
77
Configuration Switch Fabric
.........................
79
Bus Priorities
........................................
81
5
Memory Architecture
................................
82
Memory Protection
..................................
85
Bandwidth Management
............................
85
Power-Down Control
................................
86
Megamodule Resets
................................
86
Megamodule Revision
...............................
87
C64x+ Megamodule Register Description(s)
........
88
Mechanical Data
.......................................
246
Thermal Data
......................................
246
Packaging Information
.............................
246
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