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參數(shù)資料
| 型號： | TMP431BDGKT |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 模擬信號調理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PDSO8 |
| 封裝： | GREEN, PLASTIC, MSOP-8 |
| 文件頁數(shù)： | 26/40頁 |
| 文件大?。?/td> | 790K |
| 代理商： | TMP431BDGKT |
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V+
DXP
DXN
GND
GroundorV+layer
onbottomand/or
top,ifpossible.
1
2
3
4
8
7
6
5
TMP431
0.1 FCapacitor
m
PCBVia
V+
GND
DXP
DXN
1
10
2
3
4
8
7
6
5
9
TMP432
0.1 FCapacitor
m
PCBVia
V+
GND
DXP1
DXP2
DXN1
DXN2
SBOS441C
– SEPTEMBER 2009 – REVISED FEBRUARY 2011
Layout Considerations
Remote temperature sensing on the TMP431/32
measures
very
small
voltages
using
very
low
currents; therefore, noise at the IC inputs must be
minimized. Most applications using the TMP431/32
have high digital content, with several clocks and
logic level transitions creating a noisy environment.
Layout should conform to the following guidelines:
1. Place the TMP431/32 as close to the remote
junction sensor as possible.
2. Route the DXP and DXN traces next to each
other and shield them from adjacent signals
through the use of ground guard traces, as
shown in Figure 22. If a multilayer PCB is used,
bury these traces between ground or VDD planes
to shield them from extrinsic noise sources. 5 mil
Note:
Use 5 mil (.005 in, or 0,127 mm) traces
(0,127 mm) PCB traces are recommended.
with 5 mil (.005 in, or 0,127 mm) spacing.
3. Minimize
additional
thermocouple
junctions
caused by copper-to-solder connections. If these
Figure 22. Example Signal Traces
junctions are used, make the same number and
approximate
locations
of
copper-to-solder
connections
in
both
the
DXP
and
DXN
connections to cancel any thermocouple effects.
4. Use a 0.1
μF local bypass capacitor directly
between the V+ and GND of the TMP431/32.
Figure 23 shows the suggested bypass capacitor
placement for the TMP431/32. This capacitance
includes any cable capacitance between the
remote temperature sensor and TMP431/32.
5. If
the
connection
between
the
remote
temperature sensor and the TMP431/32 is less
than 8 inches (20,32 cm), use a twisted-wire pair
connection. Beyond 8 inches, use a twisted,
shielded pair with the shield grounded as close to
the TMP431/32 as possible. Leave the remote
sensor connection end of the shield wire open to
avoid ground loops and 60Hz pickup.
6. Thoroughly clean and remove all flux residue in
and around the pins of the TMP431/32 to avoid
temperature offset readings as a result of leakage
paths between DXP or DXN and GND, or
between DXP or DXN and V+.
Figure 23. Suggested Bypass Capacitor
Placement
32
2009–2011, Texas Instruments Incorporated
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| TMP431CDGKR | 功能描述:板上安裝溫度傳感器 +/-1C Remote and Local Temp Sensor RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關閉: 安裝風格: 封裝 / 箱體: 設備功能:Temperature and Humidity Sensor |
| TMP431CDGKT | 功能描述:板上安裝溫度傳感器 +/-1C Remote and Local Temp Sensor RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關閉: 安裝風格: 封裝 / 箱體: 設備功能:Temperature and Humidity Sensor |
| TMP431DDGKR | 功能描述:板上安裝溫度傳感器 +/-1C Remote and Local Temp Sensor RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關閉: 安裝風格: 封裝 / 箱體: 設備功能:Temperature and Humidity Sensor |
| TMP431DDGKT | 功能描述:板上安裝溫度傳感器 +/-1C Remote and Local Temp Sensor RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關閉: 安裝風格: 封裝 / 箱體: 設備功能:Temperature and Humidity Sensor |
| TMP432ADGSR | 功能描述:板上安裝溫度傳感器 Remote & Local Temp Sensor RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關閉: 安裝風格: 封裝 / 箱體: 設備功能:Temperature and Humidity Sensor |
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