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| 型號(hào)： | TMDS37000 |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | TMS370 MICROCONTROLLER FAMILY DATA BOOK |
| 中文描述： | TMS370微控制器系列數(shù)據(jù)手冊(cè) |
| 文件頁(yè)數(shù)： | 69/78頁(yè) |
| 文件大?。?/td> | 919K |
| 代理商： | TMDS37000 |
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MECHANICAL DATA
4–3
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251–1443
mechanical data
Table 1 is designed to aid the user when referencing a device family to the mechanical data section. The table
shows a cross-reference of the device family to the TMS370 generic package names and the associated
mechanical drawing(s) by drawing number and name.
Table 1. TMS370 Family Package Type and Mechanical Cross-Reference
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NJ formerly known as N2; the mechanical drawing of the NJ is identical to the N2 package and did not need to be requalified.
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(mil pin spacing)
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FZ – 28 pin
(50-mil pin spacing)
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á
á
á
á
á
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(PLCC)
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CERAMIC LEADED CHIP CARRIER
(CLCC)
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á
á
á
á
á
TMS370 GENERIC NAME
MECHANICAL NAME
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CHIP CARRIER
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áááááááááá
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FZ(S-CQCC-J**) J-LEADED CERAMIC
CHIP CARRIER
á
á
á
á
á
á
ááááá
á
á
FN – 28 pin
á
á
ááááá
ááááá
á
TMS370Cx0x,
á
FN – 44 pin
(50-mil pin spacing)
á
PLASTIC LEADED CHIP CARRIER
(PLCC)
á
ááááá
á
á
á
á
(50-mil pin spacing)
á
PLASTIC LEADED CHIP CARRIER
(PLCC)
á
SE370Cx0x, SE370Cx1x,
and SE370CxCx
FN(S-PQCC-J**) PLASTIC J-LEADED
á
á
ááááá
(50-mil pin spacing)
ááááá
á
(CLCC)
(CLCC)
á
áááááááááá
CHIP CARRIER
CERAMIC LEADED CHIP CARRIER
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áááááááááá
CHIP CARRIER
á
ááááá
ááááá
á
á
á
CERAMIC DUAL-IN-LINE PACKAGE
(CDIP)
á
JD(R-CDIP-T**) CERAMIC SIDE-BRAZE
DUAL-IN-LINE PACKAGE
CERAMIC LEADED CHIP CARRIER
á
SE370Cx1x and
SE370CxCx
á
JD – 28 pin
(100-mil pin spacing)
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(PDIP)
(CDIP)
á
PACKAGE
CERAMIC DUAL-IN-LINE PACKAGE
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DUAL-IN-LINE PACKAGE
á
JD(R-CDIP-T**) CERAMIC SIDE-BRAZE
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TMS370CxCx
á
(100-mil pin spacing)
ááááá
(100-mil pin spacing)
á
PACKAGE (CSDIP)
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(PDIP)
á
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DUAL-IN-LINE PACKAGE
PLASTIC DUAL-IN-LINE PACKAGE
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PACKAGE
á
TMS370CxAx
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ááááá
á
á
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á
PACKAGE (PSDIP)
á
áááááááááá
DUAL-IN-LINE PACKAGE
CERAMIC SHRINK DUAL-IN-LINE
á
á
ááááá
á
PACKAGE (CSDIP)
PACKAGE (PSDIP)
á
áááááááááá
DUAL-IN-LINE PACKAGE
áááááááááá
DUAL-IN-LINE PACKAGE
PLASTIC SHRINK DUAL-IN-LINE
á
á
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ááááá
áááááááááááááááááááááááááááááá
ááááá
á
á
á
á
á
NM – 64 pin
á
á
NM(R-PDIP-T64) PLASTIC SHRINK
á
TMS370Cx5x,
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TMDS3700572A | TMS370 MICROCONTROLLER FAMILY DATA BOOK |
| TMDS3740555-09 | TMS370 MICROCONTROLLER FAMILY DATA BOOK |
| TMDS3740850-02 | TMS370 MICROCONTROLLER FAMILY DATA BOOK |
| TMDS3740855-02 | TMS370 MICROCONTROLLER FAMILY DATA BOOK |
| TMDS3760500A | TMS370 MICROCONTROLLER FAMILY DATA BOOK |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TMDS3700572A | 制造商:TI 制造商全稱:Texas Instruments 功能描述:TMS370 MICROCONTROLLER FAMILY DATA BOOK |
| TMDS3740555-09 | 功能描述:開(kāi)發(fā)軟件 TMS370 Optimizing C Cross Compiler RoHS:否 制造商:Atollic Inc. 產(chǎn)品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors |
| TMDS3740850-02 | 功能描述:開(kāi)發(fā)軟件 TMS370 Assembler/ Linker RoHS:否 制造商:Atollic Inc. 產(chǎn)品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors |
| TMDS3740855-02 | 功能描述:開(kāi)發(fā)軟件 TMS370 Optimizing Cross Compiler RoHS:否 制造商:Atollic Inc. 產(chǎn)品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors |
| TMDS3760500A | 制造商:TI 制造商全稱:Texas Instruments 功能描述:TMS370 MICROCONTROLLER FAMILY DATA BOOK |
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