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ABSOLUTE MAXIMUM RATINGS
SLLS919A – DECEMBER 2008 – REVISED JANUARY 2009............................................................................................................................................ www.ti.com
Table 2. Control-Pin Lookup Table(1)
SIGNAL
LEVEL
STATE
DESCRIPTION
Normal operational mode for device. If LP is left floating, then a weak internal pullup to VCC
H
Normal mode
pulls it to VCC.
LP
Low-power
Device is forced into a low-power state, causing the inputs and outputs to go to a
L
mode
high-impedance state. All other inputs are ignored.
S2
S1
H
Port 1
Port 1 is selected as the active port; all other ports are low.
S[2:1]
H
L
Port 2
Port 2 is selected as the active port; all other ports are low.
GPIO
L
Port 3
Port 3 is selected as the active port; all other ports are low.
mode
HPD[1:3] follow
L
H
Standby mode: HPD[1:3] follow HPD_sink.
HPD_SINK
L
I2C
Device is configured by I2C logic.
I2C_SEL
Device is configured by GPIO. If the I2C_SEL pin is left floating, then a weak internal pullup to
H
GPIO
VCC pulls the I2C_SEL pin high.
Driver output voltage swing precision control to aid with system compliance. The VSadj
Compliant
VSadj
4.02 k
resistor value can be selected to be 4.02 k
±10% based on the system requirement to pass
voltage
HDMI compliance.
(1)
(H) Logic high; (L) Logic low
ORDERING INFORMATION(1)
PART NUMBER
PART MARKING
PACKAGE
TMDS361PAGR
TMDS361
64-pin TQFP reel (large)
TMDS361PAG
TMDS361
64-pin TQFP tray
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
Supply voltage range(2)
VCC
–0.3 to 3.6
V
TMDS I/O
–0.3 to 4
Voltage range
HPD and DDC I/O
–0.3 to 5.5
V
Control and status I/O
–0.3 to 5.5
Human body model(3) on SCL[1:3], SDA[1:3], HPD[1:3], D[0:2]+_[1:3],
±10,000
D[0:2]–_[1:3], CLK+_[1:3], CLK–_[1:3] pins
Human body model(3) on all other pins
±9,000
V
Charged-device model(4)
±1500
Electrostatic discharge
Machine model(5)
±200
IEC 61000-4-2(6), contact discharge
±8,000
IEC 61000-4-2(6), air discharge
±15,000
Continuous power dissipation
See Dissipation Ratings table
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values, except differential voltages, are with respect to network ground terminal.
(3)
Tested in accordance with JEDEC Standard 22, Test Method A114-B
(4)
Tested in accordance with JEDEC Standard 22, Test Method C101-A
(5)
Tested in accordance with JEDEC Standard 22, Test Method A115-A
(6)
Tested in accordance with IEC EN 61000-4-2
8
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