參數(shù)資料
型號(hào)： TMDS251PAGRG4
廠商： TEXAS INSTRUMENTS INC
元件分類： 多路復(fù)用及模擬開關(guān)
英文描述： 3-CHANNEL, AUDIO/VIDEO SWITCH, PQFP64
封裝： GREEN, PLASTIC, TQFP-64
文件頁數(shù)： 26/28頁
文件大?。?/td> 751K
代理商： TMDS251PAGRG4
www.ti.com
ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
THERMAL CHARACTERISTICS
RECOMMENDED OPERATING CONDITIONS
SLLS852 – AUGUST 2007
ORDERING INFORMATION(1)
PART NUMBER
PART MARKING
PACKAGE
TMDS251PAGR
TMDS251
64-PIN TQFP Tape/Reel
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
over operating free-air temperature range (unless otherwise noted)
(1)
UNIT
Supply voltage
VCC
–0.5 V to 4 V
range(2)
VDD
–0.5 V to 6 V
Anm(3), Bnm
2.5 V to 4 V
Voltage range
Ym, Zm, VSADJ, EQ
–0.5V to 4 V
SCLn, SCL_SINK, SDAn, SDA_SINK, HPDn, HPD_SINK, S1, S2
–0.5 V to 6 V
Anm, Bnm, Ym, Zm
±8000 V
Human body model(4)
All pins
±4000 V
Electrostatic
discharge
Charged-device model(5) (all pins)
±1500 V
Machine model (6) (all pins)
±200 V
See Dissipation Rating
Continuous power dissipation
Table
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
(3)
n = 1, 2; m = 1, 2, 3, 4
(4)
Tested in accordance with JEDEC Standard 22, Test Method A114-B
(5)
Tested in accordance with JEDEC Standard 22, Test Method C101-A
(6)
Tested in accordance with JEDEC Standard 22, Test Method A115-A
PCB JEDEC
DERATING FACTOR (1)
TA = 70°C
PACKAGE
TA ≤ 25°C
STANDARD
ABOVE TA = 25°C
POWER RATING
Low-K
1111 mW
11.19 mW/
°C
611 mW
64-TQFP PAG
High-K
1492 mW
14.92
820 mW
(1)
This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX(1)
UNIT
RθJB
Junction-to-board thermal
33.4
°C/W
resistance
RθJC Junction- to-case thermal
15.6
°C/W
resistance
VIH = VCC, VIL = VCC - 0.6 V, RT = 50 , AVCC = 3.3V,
PD
Device power dissipation
Am/Bm(2:4) = 2.5-Gbps HDMI data pattern,
590
750
mW
Am/Bm(1) = 250-MHz clock
(1)
The maximum rating is simulation under 3.6-V VCC, 5.5-V VDD, and 600 mV VID.
MIN
NOM
MAX
UNIT
VCC
Supply voltage
3
3.3
3.6
V
VDD
Standby supply voltage
4.5
5
5.5
V
Copyright 2007, Texas Instruments Incorporated
7
Product Folder Link(s): TMDS251
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