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參數(shù)資料
| 型號(hào)： | TMC3003R2C80 |
| 廠商： | RAYTHEON SEMICONDUCTOR |
| 元件分類： | DAC |
| 英文描述： | Triple Video D/A Converter |
| 中文描述： | TRIPLE, PARALLEL, WORD INPUT LOADING, 0.015 us SETTLING TIME, 10-BIT DAC, PQCC44 |
| 封裝： | PLASTIC, LCC-44 |
| 文件頁數(shù)： | 11/12頁 |
| 文件大小： | 96K |
| 代理商： | TMC3003R2C80 |
PRODUCT SPECIFICATION
TMC3003
REV. 1.0.3 3/5/01
11
Mechanical Dimensions
–
48-Lead LQFP Package
D
E1
E
e
PIN 1
IDENTIFIER
B
Base Plane
Seating Plane
See Lead Detail
C
0.063" Ref (1.60mm)
L
-C-
ccc
C
LEAD COPLANARITY
A2
A
A1
α
A
A1
A2
B
D/E
D1/E1
e
L
N
ND
.055
.001
.053
.006
.346
.268
.063
.005
.057
.010
.362
.284
1.40
.05
1.35
.17
8.8
6.8
1.60
.15
1.45
.27
9.2
7.2
Symbol
Inches
Min.
Max.
Min.
Max.
Millimeters
Notes
.019 BSC
.017
48
12
.50 BSC
.45
48
12
.029
.75
6
4
5
2
7
8
α
ccc
0
°
7
°
0
°
7
°
.004
0.08
Notes:
1.
2.
Dimensions "D1" and "E1" do not include mold protrusion.
Allowable protrusion is 0.25mm per side. D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
Pin 1 identifier is optional.
Dimension ND: Number of terminals.
Dimension ND: Number of terminals per package edge.
"L" is the length of terminal for soldering to a substrate.
Dimension "B" does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed the
maximum B dimension by more than 0.08mm. Dambar can not be
located on the lower radius or the foot. Minimum space between
protrusion and an adjacent lead is 0.07mm for 0.4mm and 0.5mm
pitch packages.
To be determined at seating place
—
C
—
3.
4.
5.
6.
7.
8.
D1
All dimensions and tolerances conform to ANSI Y14.5M-1982.
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| TMC3003R2C30 | Triple Video D/A Converter |
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