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參數(shù)資料
| 型號(hào)： | TLV5510INS |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | 2.7-V TO 3.6-V 8-BIT HIGH-SPEED ANALOG-TO-DIGITAL CONVERTER |
| 中文描述： | 2.7 - V到3.6V的8位高速模擬數(shù)字轉(zhuǎn)換器 |
| 文件頁(yè)數(shù)： | 11/19頁(yè) |
| 文件大?。?/td> | 307K |
| 代理商： | TLV5510INS |
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TLV5510
2.7-V TO 3.6-V 8-BIT HIGH-SPEED ANALOG-TO-DIGITAL CONVERTER
SLAS124C– DECEMBER 1997 – REVISED DECEMBER 1999
11
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
The following notes are design recommendations that should be used with the TLV5510.
External analog and digital circuitry should be physically separated and shielded as much as possible to
reduce system noise.
RF breadboarding or printed-circuit-board (PCB) techniques should be used throughout the evaluation and
production process. Breadboards should be copper clad for bench evaluation.
Since AGND and DGND are connected internally, the ground lead in must be kept as noise free as possible.
A good method to use is twisted-pair cables for the supply lines to minimize noise pickup. An analog and
digital ground plane should be used on PCB layouts when additional logic devices are used. The AGND
and DGND terminals of the device should be tied to the analog ground plane.
V
DDA
to AGND and V
DDD
to DGND should be decoupled with 1-
μ
F and 0.01-
μ
F capacitors, respectively,
placed as close as possible to the appropriate device terminals. A ceramic chip capacitor is recommended
for the 0.01-
μ
F capacitor. Care should be exercised to assure a solid noise-free ground connection for the
analog and digital grounds.
V
DDA
, AGND, and ANALOG IN terminals should be shielded from the higher frequency terminals, CLK and
D0–D7. If possible, AGND traces should be placed on both sides of the ANALOG IN traces on the PCB for
shielding.
In testing or application of the device, the resistance of the driving source connected to the analog input
should be 10
or less within the analog frequency range of interest.
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| TLV5510IPW | 制造商:TI 制造商全稱:Texas Instruments 功能描述:2.7-V TO 3.6-V 8-BIT HIGH-SPEED ANALOG-TO-DIGITAL CONVERTER |
| TLV5535 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:8-BIT, 35 MSPS, LOW-POWER ANALOG-TO-DIGITAL CONVERTER |
| TLV5535EVM | 功能描述:數(shù)據(jù)轉(zhuǎn)換 IC 開發(fā)工具 TLV5535 Eval Mod RoHS:否 制造商:Texas Instruments 產(chǎn)品:Demonstration Kits 類型:ADC 工具用于評(píng)估:ADS130E08 接口類型:SPI 工作電源電壓:- 6 V to + 6 V |
| TLV5535IPW | 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 8bit 35Msps 1ch 3.3V RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32 |
| TLV5535IPWG4 | 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 8 Bit 35 MSPS Single Ch. Low Pwr RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32 |
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