- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄297501 > TLV320AIC29_07 (Texas Instruments, Inc.) STWREO AUDIO CODEC WITH INTERGRATED HEADPHONE AND SPEAKER AMPLIFIERS PDF資料下載
參數(shù)資料
| 型號(hào)： | TLV320AIC29_07 |
| 廠商： | Texas Instruments, Inc. |
| 元件分類(lèi)： | Codec |
| 英文描述： | STWREO AUDIO CODEC WITH INTERGRATED HEADPHONE AND SPEAKER AMPLIFIERS |
| 中文描述： | STWREO音頻編解碼器集成耳機(jī)和音箱放大器 |
| 文件頁(yè)數(shù)： | 87/94頁(yè) |
| 文件大?。?/td> | 1073K |
| 代理商： | TLV320AIC29_07 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)當(dāng)前第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TLV320AIC29IRGZR
ACTIVE
QFN
RGZ
48
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC29IRGZRG4
ACTIVE
QFN
RGZ
48
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC29IRGZT
ACTIVE
QFN
RGZ
48
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC29IRGZTG4
ACTIVE
QFN
RGZ
48
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
Addendum-Page 1
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TLW-102-06-G-D-01 | 4 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER |
| TM16EN72LPU-40 | 16M X 72 EDO DRAM MODULE, 20 ns, DMA168 |
| TM16EN72LPU-60 | 16M X 72 EDO DRAM MODULE, 30 ns, DMA168 |
| TM3102 | 1200 MHz - 1700 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER |
| TM5RU | RIGHT ANGLE TELECOM AND DATACOM CONNECTOR, JACK |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TLV320AIC29EVM | 功能描述:音頻 IC 開(kāi)發(fā)工具 TLV320AIC29 Eval Mod RoHS:否 制造商:Texas Instruments 產(chǎn)品:Evaluation Kits 類(lèi)型:Audio Amplifiers 工具用于評(píng)估:TAS5614L 工作電源電壓:12 V to 38 V |
| TLV320AIC29EVM-PDK | 功能描述:音頻 IC 開(kāi)發(fā)工具 TLV320AIC29-PDK Eval Mod RoHS:否 制造商:Texas Instruments 產(chǎn)品:Evaluation Kits 類(lèi)型:Audio Amplifiers 工具用于評(píng)估:TAS5614L 工作電源電壓:12 V to 38 V |
| TLV320AIC29IRGZ | 制造商:TI 制造商全稱:Texas Instruments 功能描述:STWREO AUDIO CODEC WITH INTERGRATED HEADPHONE AND SPEAKER AMPLIFIERS |
| TLV320AIC29IRGZR | 功能描述:接口—CODEC Stereo Codec RoHS:否 制造商:Texas Instruments 類(lèi)型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類(lèi)型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel |
| TLV320AIC29IRGZRG4 | 功能描述:接口—CODEC Stereo Codec RoHS:否 制造商:Texas Instruments 類(lèi)型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類(lèi)型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。