- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄383957 > TLV2770IDGK (Texas Instruments, Inc.) FAMILY OF 2.7-V HIGH-SLEW-RATE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN PDF資料下載
參數(shù)資料
| 型號： | TLV2770IDGK |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | FAMILY OF 2.7-V HIGH-SLEW-RATE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN |
| 中文描述： | 2.7家庭- V高，擺率軌到軌輸出運算放大器具有關斷 |
| 文件頁數(shù)： | 38/63頁 |
| 文件大?。?/td> | 1148K |
| 代理商： | TLV2770IDGK |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁當前第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁
TLV277x, TLV277xA
FAMILY OF 2.7-V HIGH-SLEW-RATE RAIL-TO-RAIL OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS209F
–
JANUARY 1998
–
REVISED MARCH 2001
38
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
circuit layout considerations
To achieve the levels of high performance of the TLV277x, follow proper printed-circuit board design techniques.
A general set of guidelines is given in the following.
Ground planes
—
It is highly recommended that a ground plane be used on the board to provide all
components with a low inductive ground connection. However, in the areas of the amplifier inputs and
output, the ground plane can be removed to minimize the stray capacitance.
Proper power supply decoupling
—
Use a 6.8-
μ
F tantalum capacitor in parallel with a 0.1-
μ
F ceramic
capacitor on each supply terminal. It may be possible to share the tantalum among several amplifiers
depending on the application, but a 0.1-
μ
F ceramic capacitor should always be used on the supply terminal
of every amplifier. In addition, the 0.1-
μ
F capacitor should be placed as close as possible to the supply
terminal. As this distance increases, the inductance in the connecting trace makes the capacitor less
effective. The designer should strive for distances of less than 0.1 inches between the device power
terminals and the ceramic capacitors.
Sockets
—
Sockets can be used but are not recommended. The additional lead inductance in the socket pins
will often lead to stability problems. Surface-mount packages soldered directly to the printed-circuit board
is the best implementation.
Short trace runs/compact part placements
—
Optimum high performance is achieved when stray series
inductance has been minimized. To realize this, the circuit layout should be made as compact as possible,
thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting input of
the amplifier. Its length should be kept as short as possible. This will help to minimize stray capacitance at
the input of the amplifier.
Surface-mount passive components
—
Using surface-mount passive components is recommended for high
performance amplifier circuits for several reasons. First, because of the extremely low lead inductance of
surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small
size of surface-mount components naturally leads to a more compact layout thereby minimizing both stray
inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be
kept as short as possible.
相關PDF資料 |
PDF描述 |
|---|---|
| TLV2771AID | FAMILY OF 2.7-V HIGH-SLEW-RATE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN |
| TLV2771CDBV | FAMILY OF 2.7-V HIGH-SLEW-RATE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN |
| TLV2771IDBV | FAMILY OF 2.7-V HIGH-SLEW-RATE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN |
| TLV2773CD | FAMILY OF 2.7-V HIGH-SLEW-RATE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN |
| TLV277X | 2.7-V High-Slew-Rate Rail-to-Rail Output Operational Amplifier Family |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| TLV2770IDGKR | 功能描述:運算放大器 - 運放 Sngl 2.7V Hi-Slew-Rt R-to-R Out w/Shtdwn RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| TLV2770IDGKRG4 | 功能描述:運算放大器 - 運放 Sngl 2.7V Hi-Slew-Rt R-to-R Out w/Shtdwn RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| TLV2770IDR | 功能描述:運算放大器 - 運放 Sngl 2.7V Hi-Slew-Rt R-to-R Out w/Shtdwn RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| TLV2770IDRG4 | 功能描述:運算放大器 - 運放 Sngl 2.7V Hi-Slew-Rt R-to-R Out w/Shtdwn RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| TLV2770IP | 功能描述:運算放大器 - 運放 Rail-Rail RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
發(fā)布緊急采購，3分鐘左右您將得到回復。