參數(shù)資料
型號(hào)： TLV2544EVM
廠商： Texas Instruments, Inc.
英文描述： 12-BIT ADC EVALUATION MODULE(12位ADC評(píng)估板)
中文描述： 12位ADC評(píng)估板（12位ADC的評(píng)估板）
文件頁(yè)數(shù)： 36/36頁(yè)
文件大小： 775K
代理商： TLV2544EVM
Printed Circuit Board Grounding Considerations
A-2
Grounding Considerations
A.1 Printed Circuit Board Grounding Considerations
When designing analog circuits that share a ground with digital and high
current power supplies, the voltage drop along the high current paths must be
considered. This voltage drop is a result of the current flowing through the
greater than zero resistance of the current path, or high frequency current
transients flowing through a greater than zero inductance of a current path.
If the signal ground is connected to the power supply ground at an improper
location, an excessive voltage drop may occur in the signal ground and
appears as part of the signal, causing an error.
The solution for low frequency analog signals is to establish a single ground
point on the PC board and connect all low frequency grounds to that point. By
using this method, currents flowing along any one path to ground do not
produce error voltages in any other ground path.
Analyzing the current flow paths within the analog section gives an indication
of which components can be lumped together to a common ground path and
which should be separate. One half LSB error with a reference of 4.1 volts
would be approximately 0.5 mV, so the ground trace resistance would have to
be no greater than 0.5 ohms with 1 mA of ground current.
When input source signals are low current, a common ground trace may be
appropriate. Higher input current sources, however, should always have a
separate ground trace to the most robust ground point location, usually at the
ground entrance to the PCB.
Even though the TLV1544/2544/2548 operating current is low, some high
speed current transients are present, usually caused by output digital
switching requiring a ground plane or wide ground return trace to the central
board entry ground for these signals. All signal paths and their respective
ground returns must be examined to minimize signal loop area.
The power inputs and V
CC
lines must also be analyzed in the same manner
and detail that the ground returns are.
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TLV2544ID 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 12bit 200KSPS SAR RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類(lèi)型:Differential 信噪比:107 dB 接口類(lèi)型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
TLV2544IDG4 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 12-Bit 200 kSPS Serial Out RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類(lèi)型:Differential 信噪比:107 dB 接口類(lèi)型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
TLV2544IDR 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 12-Bit 200 kSPS Serial Out RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類(lèi)型:Differential 信噪比:107 dB 接口類(lèi)型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
TLV2544IDRG4 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 12-Bit 200 kSPS Serial Out RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類(lèi)型:Differential 信噪比:107 dB 接口類(lèi)型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
TLV2544IPW 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 12bit 200KSPS SAR RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類(lèi)型:Differential 信噪比:107 dB 接口類(lèi)型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
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