![](http://datasheet.mmic.net.cn/370000/TLV2252MFK_datasheet_16739443/TLV2252MFK_42.png)
TLV225x, TLV225xA
Advanced LinCMOS
RAIL-TO-RAIL
VERY LOW-POWER OPERATIONAL AMPLIFIERS
SLOS185C
–
FEBRUARY 1997
–
REVISED
–
MARCH 2001
42
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
MECHANICAL INFORMATION
J (R-GDIP-T**)
CERAMIC DUAL-IN-LINE PACKAGE
4040083/B 04/95
14 PIN SHOWN
22
0.410
(10,41)
0.390
(9,91)
(28,00)
1.100
0.388
(9,65)
20
18
16
14
PINS **
0.310
(7,87)
0.290
(7,37)
0.755
(19,18)
(19,94)
0.785
0.310
(7,87)
(7,37)
0.290
(23,10)
0.910
0.300
(7,62)
(6,22)
0.245
A
0.300
(7,62)
(6,22)
0.245
0.290
(7,37)
(7,87)
0.310
0.785
(19,94)
(19,18)
0.755
A MIN
A MAX
B MAX
B MIN
0.245
(6,22)
(7,11)
0.280
C MIN
C MAX
DIM
0.245
(6,22)
(7,62)
0.300
0.975
(24,77)
(23,62)
0.930
0.290
(7,37)
(7,87)
0.310
Seating Plane
0.014 (0,36)
0.008 (0,20)
C
8
7
0.020 (0,51) MIN
B
0.070 (1,78)
0.100 (2,54)
0.065 (1,65)
0.045 (1,14)
14
1
0.015 (0,38)
0.023 (0,58)
0.200 (5,08) MAX
0.130 (3,30) MIN
0.100 (2,54)
0
°
–
15
°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification only on press ceramic glass frit seal only.
E. Falls within MIL STD 1835 GDIP1-T14, GDIP1-T16, GDIP1-T18, GDIP1-T20, and GDIP1-T22.