參數(shù)資料
型號: TLV2231Y
廠商: Texas Instruments, Inc.
英文描述: Advanced LinCMOSE RAIL-TO-RAIL LOW-POWER SINGLE OPERATIONAL AMPLIFIERS
中文描述: 高級LinCMOSE軌至軌低功率運(yùn)算放大器
文件頁數(shù): 1/27頁
文件大?。?/td> 585K
代理商: TLV2231Y
TLV2231, TLV2231Y
Advanced LinCMOS
RAIL-TO-RAIL
LOW-POWER SINGLE OPERATIONAL AMPLIFIERS
SLOS158C – JUNE 1996 – REVISED SEPTEMBER 1997
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Output Swing Includes Both Supply Rails
Low Noise . . . 15 nV/
Hz Typ at f = 1 kHz
Low Input Bias Current . . . 1 pA Typ
Fully Specified for Single-Supply 3-V and
5-V Operation
Common-Mode Input Voltage Range
Includes Negative Rail
High Gain Bandwidth . . . 2 MHz at
V
DD
= 5 V with 600
Load
High Slew Rate . . . 1.6 V/
μ
s at V
DD
= 5 V
Wide Supply Voltage Range
2.7 V to 10 V
Macromodel Included
description
The TLV2231 is a single low-voltage operational amplifier available in the SOT-23 package. It offers 2 MHz of
bandwidth and 1.6 V/
μ
s of slew rate for applications requiring good ac performance. The device exhibits
rail-to-rail output performance for increased dynamic range in single or split supply applications. The TLV2231
is fully characterized at 3 V and 5 V and is optimized for low-voltage applications.
The TLV2231, exhibiting high input impedance and low noise, is excellent for small-signal conditioning of
high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels
combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing
applications. In addition, the rail-to-rail output feature with single- or split-supplies makes this family a great
choice when interfacing with analog-to-digital converters (ADCs). The device can also drive 600-
loads for
telecom applications.
With a total area of 5.6mm
2
, the SOT-23 package only requires one-third the board space of the standard 8-pin
SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal
source, minimizing noise pick-up from long PCB traces. TI has also taken special care to provide a pinout that
is optimized for board layout (see Figure 1). Both inputs are separated by GND to prevent coupling or leakage
paths. The OUT and IN– terminals are on the same end of the board for providing negative feedback. Finally,
gain setting resistors and decoupling capacitor are easily placed around the package.
VI
VDD+
OUT
IN–
VDD/GND
IN+
C
RI
RF
GND
V+
VO
1
2
3
4
5
Figure 1. Typical Surface Mount Layout for a Fixed-Gain Noninverting Amplifier
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DBV PACKAGE
(TOP VIEW)
5
4
3
1
2
IN–
VDD–/GND
IN+
VDD+
OUT
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
1997, Texas Instruments Incorporated
Advanced LinCMOS is a trademark of Texas Instruments Incorporated.
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