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參數(shù)資料
| 型號： | TLV1571CDWG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | ADC |
| 英文描述： | 1-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO24 |
| 封裝： | GREEN, PLASTIC, SOIC-24 |
| 文件頁數(shù)： | 8/33頁 |
| 文件大?。?/td> | 627K |
| 代理商： | TLV1571CDWG4 |
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TLV1571, TLV1578
2.7 V TO 5.5 V, 1-/8-CHANNEL, 10-BIT,
PARALLEL ANALOG-TO-DIGITAL CONVERTERS
SLAS170D –MARCH 1999 – REVISED JULY 2000
16
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
grounding and decoupling considerations
General practices should apply to the PCB design to limit high frequency transients and noise that are fed back
into the supply and reference lines. This requires that the supply and reference pins be sufficiently bypassed.
In most cases 0.1-
F ceramic chip capacitors are adequate to keep the impedance low over a wide frequency
range. Since their effectiveness depends largely on the proximity to the individual supply pin, they should be
placed as close to the supply pins as possible.
To reduce high frequency and noise coupling, it is highly recommended that digital and analog grounds be
shorted immediately outside the package. This can be accomplished by running a low impedance line between
DGND and AGND under the package.
TLV1571/78
100 nF
DGND
DVDD
AVDD
AGND
REFP
REFM
100 nF
VREFP
VREFM
AVDD
DVDD
Figure 9. Placement for Decoupling Capacitors
power supply ground layout
Printed-circuit boards that use separate analog and digital ground planes offer the best system performance.
Wire-wrap boards do not perform well and should not be used. The two ground planes should be connected
together at the low-impedance power-supply source. The best ground connection may be achieved by
connecting the ADC AGND terminal to the system analog ground plane making sure that analog ground
currents are well managed.
Rs
Ri(MUX)
VS
VC
15 pF
Driving Source
TLV1571/78
Ci
VI
VI = Input Voltage at AIN
VS = External Driving Source Voltage
Rs = Source Resistance
Ri(ADC)= Input Resistance of ADC
Ri(MUX)= Input Resistance (MUX on resistance)
Ci = Input Capacitance
VC= Capacitance Charging Voltage
Driving source requirements:
Noise and distortion for the source must be equivalent to the resolution of the converter.
Rs must be real at the input frequency.
Ri(ADC)
MO
AIN
Figure 10. Equivalent Input Circuit Including the Driving Source
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TLV1578CDARG4 | 8-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO32 |
| TLV1571IDW | 1-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO24 |
| TLV1571CPW | 1-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO24 |
| TLV1571IDWR | 1-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO24 |
| TLV1571CDWR | 1-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO24 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TLV1571CPW | 制造商:Rochester Electronics LLC 功能描述:10 BIT, 1.2 MSPS, PARALLEL ADC, 1/8 CHAN - Bulk |
| TLV1571IDW | 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 10bit 1.2 MSPS PA RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32 |
| TLV1571IDWG4 | 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 10bit 1.2 MSPS PA RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32 |
| TLV1571IPW | 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 10bit 1.2 MSPS PA RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32 |
| TLV1571IPWG4 | 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 1-Ch 10-Bit 1.25MSPS 8-Ch DSP/SPI RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32 |
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