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參數(shù)資料
| 型號： | TLV1393ID |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | DUAL DIFFERENTIAL COMPARATORS |
| 中文描述： | 雙差分比較器 |
| 文件頁數(shù)： | 4/16頁 |
| 文件大?。?/td> | 254K |
| 代理商： | TLV1393ID |
TLV1393, TLV1393Y, TLV2393, TLV2393Y
DUAL DIFFERENTIAL COMPARATORS
SLCS121A – AUGUST 1993 – REVISED APRIL 1994
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLV1393Y chip information
This chip, when properly assembled, displays characteristics similar to the TLV1393. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 13 TYPICAL
BONDING PADS: 3.54
×
3.54 MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
–
1OUT
1IN+
1IN–
VCC
(8)
(6)
(3)
(2)
(5)
(1)
–
+
(7)
2IN+
2IN–
2OUT
(4)
GND
32
38
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TLV2393ID | DUAL DIFFERENTIAL COMPARATORS |
| TLV1393IP | DUAL DIFFERENTIAL COMPARATORS |
| TLV2393IP | DUAL DIFFERENTIAL COMPARATORS |
| TLV1393IPWLE | DUAL DIFFERENTIAL COMPARATORS |
| TLV2393IPWLE | DUAL DIFFERENTIAL COMPARATORS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TLV1393IDR | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| TLV1393IP | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| TLV1393IPWLE | 制造商:TI 制造商全稱:Texas Instruments 功能描述:DUAL DIFFERENTIAL COMPARATORS |
| TLV1393IPWR | 制造商:Texas Instruments 功能描述: |
| TLV1393Y | 制造商:TI 制造商全稱:Texas Instruments 功能描述:DUAL DIFFERENTIAL COMPARATORS |
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