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參數(shù)資料
| 型號(hào)： | TLE2022MFK |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 運(yùn)動(dòng)控制電子 |
| 英文描述： | EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS |
| 中文描述： | 神劍高速低功耗精密運(yùn)算放大器 |
| 文件頁(yè)數(shù)： | 7/66頁(yè) |
| 文件大?。?/td> | 1102K |
| 代理商： | TLE2022MFK |
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TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191 – FEBRUARY 1997
7
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLE2024Y chip information
This chip, when properly assembled, displays characteristics similar to the TLE2024. Thermal compression or
ultrasonic bonding may be used on the doped aluminum-bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
×
4 MILS MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
–
1OUT
1IN+
1IN–
VCC+
(4)
(6)
(3)
(2)
(5)
(1)
–
+
(7)
2IN+
2IN–
2OUT
(11)
VCC–/GND
+
–
3OUT
2IN+
3IN–
(13)
(10)
(9)
(12)
(8)
–
+
(14)
4OUT
4IN+
4IN–
100
140
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TLE2022MP | EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS |
| TLE2022Y | EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS |
| TLE2021AMFK | EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS |
| TLE2081MFK | EXCALIBUR HIGH-SPEED JFET-INPUT OPERATIONAL AMPLIFIERS |
| TLE2081MJG | EXCALIBUR HIGH-SPEED JFET-INPUT OPERATIONAL AMPLIFIERS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TLE2022MFKB | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| TLE2022MJG | 制造商:Texas Instruments 功能描述: |
| TLE2022MJGB | 制造商:Texas Instruments 功能描述: 制造商:Texas Instruments 功能描述:EXCALIBUR HI-SPEED LOW-PWR OPERATION AMP |
| TLE2022MLB | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| TLE2022MP | 制造商:TI 制造商全稱:Texas Instruments 功能描述:EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS |
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