參數(shù)資料
型號(hào): TLE2021AMP
廠商: Texas Instruments, Inc.
元件分類: 運(yùn)動(dòng)控制電子
英文描述: EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS
中文描述: 神劍高速低功耗精密運(yùn)算放大器
文件頁數(shù): 2/66頁
文件大小: 1102K
代理商: TLE2021AMP
TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191 – FEBRUARY 1997
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLE2021 AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
FORM§
(Y)
TA
VIOmax
AT 25
°
C
SMALL
OUTLINE
(D)
SSOP
(DB)
CHIP
CARRIER
(FK)
CERAMIC DIP
(JG)
PLASTIC DIP
(P)
TSSOP
(PW)
0
°
C to
70
°
C
200
V
500
μ
V
TLE2021ACD
TLE2021CD
TLE2021CDBLE
TLE2021ACP
TLE2021CP
μ
TLE2021CPWLE
TLE2021Y
–40
°
C
to
85
°
C
–55
°
C
to
125
°
C
The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR).
The DB and PW packages are only available left-end taped and reeled.
§Chip forms are tested at 25
°
C only.
200
V
500
μ
V
TLE2021AID
TLE2021ID
TLE2021AIP
TLE2021IP
μ
100
V
200
μ
V
500
μ
V
TLE2021BMFK
TLE2021AMFK
TLE2021MFK
TLE2021BMJG
TLE2021AMJG
TLE2021MJG
μ
TLE2021AMD
TLE2021MD
TLE2021AMP
TLE2021MP
TLE2022 AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
FORM§
(Y)
TA
VIOmax
AT 25
°
C
SMALL
OUTLINE
(D)
SSOP
(DB)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP
(PW)
0
°
C
to
70
°
C
150
μ
V
μ
300
V
500
μ
V
TLE2022BCD
TLE2022ACD
TLE2022CD
TLE2022ACP
TLE2022CP
TLE2022CDBLE
TLE2022CPWLE
TLE2022Y
–40
°
C
to
85
°
C
150
μ
V
μ
300
V
500
μ
V
TLE2022BID
TLE2022AID
TLE2022ID
TLE2022AIP
TLE2022IP
–55 C
°
C
to
125
°
C
The D packages are available taped and reeled. To oerder a taped and reeled part, add the suffix R (e.g., TLE2022CDR).
The DB and PW packages are only available left-end taped and reeled.
Chip forms are tested at 25
°
C only.
150
μ
V
300
V
500
μ
V
TLE2022BMJG
TLE2022AMJG
TLE2022MJG
TLE2022AMD
TLE2022MD
TLE2022AMFK
TLE2022MFK
TLE2022AMP
TLE2022MP
μ
TLE2024 AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
CARRIER
(FK)
CHIP
FORM
(Y)
TA
VIOmax
AT 25
°
C
SMALL
OUTLINE
(DW)
CERAMIC
DIP
(J)
PLASTIC
DIP
(N)
500
V
μ
750
V
1000
μ
V
TLE2024BCDW
TLE2024ACDW
TLE2024CDW
TLE2024BCN
TLE2024ACN
TLE2024CN
0
°
C to 70
°
C
μ
TLE2024Y
500
μ
V
750
V
1000
μ
V
500
V
750
μ
V
1000
μ
V
TLE2024BIDW
TLE2024AIDW
TLE2024IDW
TLE2024BIN
TLE2024AIN
TLE2024IN
–40
°
C to 85
°
C
μ
TLE2024BMDW
TLE2024AMDW
TLE2024MDW
TLE2024BMFK
TLE2024AMFK
TLE2024MFK
TLE2024BMJ
TLE2024AMJ
TLE2024MJ
TLE2024BMN
TLE2024AMN
TLE2024MN
–55
°
C to 125
°
C
μ
Chip forms are tested at 25
°
C only.
相關(guān)PDF資料
PDF描述
TLE2021BMFK EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS
TLE2021CDBLE EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS
TLE2022CPWLE EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS
TLE2022CDBLE EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS
TLE2021MFK EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS
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TLE2021AQPWRQ1 制造商:TI 制造商全稱:Texas Instruments 功能描述:EXCALIBUR HIGH-SPEED LOW-POWER PRECISION POERATIONAL AMPLIFIERS
TLE2021BMFK 制造商:TI 制造商全稱:Texas Instruments 功能描述:EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS