參數(shù)資料
型號(hào): TLC374Y
廠商: Texas Instruments, Inc.
元件分類: 比較器
英文描述: LinCMOSE QUADRUPLE DIFFERENTIAL COMPARATORS
中文描述: LinCMOSE翻兩番差比較器
文件頁(yè)數(shù): 3/18頁(yè)
文件大?。?/td> 268K
代理商: TLC374Y
TLC374, TLC374Q, TLC374Y
LinCMOS
QUADRUPLE DIFFERENTIAL COMPARATORS
SLCS118C – NOVEMBER 1983 – REVISED MARCH 1999
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLC374Y chip information
This chip, when properly assembled, displays characteristics similar to the TLC374C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
×
4 MINIMUM
TJMAX = 150
°
C
TOLERANCES ARE
±
10%
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
3OUT
3IN+
3IN–
GND
(10)
(9)
(8)
(11)
(14)
+
(13)
4IN+
4IN–
4OUT
(12)
+
VDD
(3)
(4)
(7)
(6)
(5)
(1)
+
(2)
65
90
1IN+
1IN–
2OUT
1OUT
2IN+
2IN–
(13)
(14)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
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