參數(shù)資料
型號： TLC2272MU
廠商： Texas Instruments, Inc.
英文描述： Advanced LinCMOSTM RAIL-TO-RAIL OPERATIONAL AMPLIFIERS
中文描述： 高級LinCMOSTM軌至軌運(yùn)算放大器
文件頁數(shù)： 2/64頁
文件大?。?/td> 1342K
代理商： TLC2272MU
SLOS190G FEBRUARY 1997 REVISED MAY 2004
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLC2272 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
At 25
°
C
SMALL
OUTLINE
(D)
CERAMIC
LCC
(FK)
CERAMIC
DIP
(JG)
PLASTIC DIP
(P)
TSSOP
(PW)
CERAMIC
FLAT PACK
(U)
0
°
C to 70
°
C
μ
950
V
2.5 mV
TLC2272ACD
TLC2272CD
—
—
—
—
TLC2272ACP
TLC2272CP
TLC2272ACPW
—
—
TLC2272CPW
950
μ
V
2.5 mV
TLC2272AID
TLC2272ID
—
—
—
—
TLC2272AIP
TLC2272IP
—
—
—
40
°
C to 125
°
C
TLC2272IPW
950
μ
V
2.5 mV
TLC2272AQD
TLC2272QD
—
—
—
—
TLC2272AQPW
TLC2272QPW
—
—
—
55
°
C to 125
°
C
950
μ
V
2.5 mV
TLC2272AMD
TLC2272MD
TLC2272AMFK
TLC2272MFK
TLC2272AMJG
TLC2272MJG
TLC2272AMP
TLC2272MP
—
TLC2272AMU
TLC2272MU
The D packages are available taped and reeled. Add R suffix to the device type (e.g., TLC2272CDR).
The PW package is available taped and reeled. Add R suffix to the device type (e.g., TLC2272PWR).
§Chips are tested at 25
°
C.
TLC2274 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25
°
C
SMALL
OUTLINE
(D)
CERAMIC
LCC
(FK)
CERAMIC
DIP
(J)
PLASTIC
DIP
(N)
TSSOP
(PW)
CERAMIC
FLAT PACK
(W)
0
°
C to 70
°
C
950
μ
V
2.5 mV
TLC2274ACD
TLC2274CD
TLC2274ACN
TLC2274CN
TLC2274ACPW
TLC2274CPW
—
—
—
950
μ
V
2.5 mV
TLC2274AID
TLC2274ID
TLC2274AIN
TLC2274IN
TLC2274AIPW
TLC2274IPW
40
°
C to 125
°
C
—
—
—
950
μ
V
2.5 mV
TLC2274AQD
TLC2274QD
—
—
—
—
—
55
°
C to 125
°
C
950
μ
V
2.5 mV
TLC2274AMD
TLC2274MD
TLC2274AMFK
TLC2274MFK
TLC2274AMJ
TLC2274MJ
TLC2274AMN
TLC2274MN
—
TLC2274AMW
TLC2274MW
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2274CDR).
The PW package is available taped and reeled.
§Chips are tested at 25
°
C.
相關(guān)PDF資料
PDF描述
TLC2274AMJ Advanced LinCMOSE RAIL-TO-RAIL OPERATIONAL AMPLIFIERS
TLC2274CDB Advanced LinCMOSTM RAIL-TO-RAIL OPERATIONAL AMPLIFIERS
TLC2274CNSR-A Advanced LinCMOSTM RAIL-TO-RAIL OPERATIONAL AMPLIFIERS
TLC2272AMU Advanced LinCMOSTM RAIL-TO-RAIL OPERATIONAL AMPLIFIERS
TLC2274AMW Advanced LinCMOSTM RAIL-TO-RAIL OPERATIONAL AMPLIFIERS
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TLC2272MUB 制造商:TI 制造商全稱:Texas Instruments 功能描述:Advanced LinCMOSTM RAIL-TO-RAIL OPERATIONAL AMPLIFIERS
TLC2272-Q1 制造商:TI 制造商全稱:Texas Instruments 功能描述:ADVANCED LinCMOSa?￠ RAIL-TO-RAIL OPERATIONAL AMPLIFIERS
TLC2272QD 功能描述:運(yùn)算放大器 - 運(yùn)放 Dual Low Noise RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLC2272QDG4 功能描述:運(yùn)算放大器 - 運(yùn)放 Dual LoNoise Rail To Rail OP AMP RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLC2272QDR 功能描述:運(yùn)算放大器 - 運(yùn)放 Dual Lo-Noise R-To-R Op Amp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
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