參數(shù)資料
型號(hào)： TLC2262C
廠商： Texas Instruments, Inc.
英文描述： Advanced LinCMOS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS
中文描述： 高級(jí)LinCMOS軌至軌運(yùn)算放大器
文件頁(yè)數(shù)： 2/59頁(yè)
文件大?。?/td> 932K
代理商： TLC2262C
TLC226x, TLC226xA
Advanced LinCMOS
RAIL-TO-RAIL
OPERATIONAL AMPLIFIERS
SLOS177A – FEBRUARY 1997 – REVISED JULY 1999
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLC2262 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25
°
C
SMALL
OUTLINE
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP
(PW)
CERAMIC
FLATPACK
(U)
0
°
C to 70
°
C
2.5 mV
TLC2262CD
—
—
TLC2262CP
TLC2262CPWLE
—
–40
°
C to 125
°
C
950
V
2.5 mV
TLC2262AID
TLC2262ID
—
—
—
—
TLC2262AIP
TLC2262IP
TLC2262AIPWLE
—
—
—
μ
–40
°
C to 125
°
C
950
V
2.5 mV
TLC2262AQD
TLC2262QD
—
—
—
—
—
—
—
—
—
—
μ
–55
°
C to 125
°
C
950
μ
V
2.5 mV
—
—
TLC2262AMFK
TLC2262MFK
TLC2262AMJG
TLC2262MJG
—
—
—
—
TLC2262AMU
TLC2262MU
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2262CDR). The PW package is available only left-end taped
and reeled. Chips are tested at 25
°
C.
TLC2264 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25
°
C
SMALL
OUTLINE
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(J)
PLASTIC
DIP
(N)
TSSOP
(PW)
CERAMIC
FLATPACK
(W)
0
°
C to 70
°
C
2.5 mV
TLC2264CD
—
—
TLC2264CN
TLC2264CPWLE
—
–40
°
C to 125
°
C
950
V
2.5 mV
TLC2264AID
TLC2264ID
—
—
—
—
TLC2264AIN
TLC2264IN
TLC2264AIPWLE
—
—
—
μ
–40
°
C to 125
°
C
950
V
2.5 mV
TLC2264AQD
TLC2264QD
—
—
—
—
—
—
—
—
—
—
μ
–55
°
C to 125
°
C
950
μ
V
2.5 mV
—
—
TLC2264AMFK
TLC2264MFK
TLC2264AMJ
TLC2264MJ
—
—
—
—
TLC2264AMW
TLC2264MW
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2264CDR). The PW package is available only left-end taped
and reeled. Chips are tested at 25
°
C.
相關(guān)PDF資料
PDF描述
TLC2274AMFK Advanced LinCMOSE RAIL-TO-RAIL OPERATIONAL AMPLIFIERS
TLC2272QPW Advanced LinCMOSE RAIL-TO-RAIL OPERATIONAL AMPLIFIERS
TLC2272QPWR Advanced LinCMOSTM RAIL-TO-RAIL OPERATIONAL AMPLIFIERS
TLC2274MFK Advanced LinCMOSE RAIL-TO-RAIL OPERATIONAL AMPLIFIERS
TLC2274AMN Advanced LinCMOSE RAIL-TO-RAIL OPERATIONAL AMPLIFIERS
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TLC2262CD 功能描述:運(yùn)算放大器 - 運(yùn)放 Dual Rail-Rail RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLC2262CD 制造商:Texas Instruments 功能描述:Operational Amplifier (Op-Amp) IC
TLC2262CDG4 功能描述:運(yùn)算放大器 - 運(yùn)放 Dual Rail-Rail RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLC2262CDR 功能描述:運(yùn)算放大器 - 運(yùn)放 Dual R/R Op Amp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLC2262CDRG4 功能描述:運(yùn)算放大器 - 運(yùn)放 Dual Adv LinCMOS Rail-to-Rail RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
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