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參數(shù)資料
| 型號(hào)： | TLC085IPWPG4 |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | TRANS PREBIASED NPN 200MW SOT23 |
| 中文描述： | 家庭寬帶高輸出驅(qū)動(dòng)單電源運(yùn)算放大器 |
| 文件頁數(shù)： | 22/52頁 |
| 文件大?。?/td> | 1462K |
| 代理商： | TLC085IPWPG4 |
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SLOS254D JUNE 1999 REVISED FEBRUARY 2004
22
WWW.TI.COM
APPLICATION INFORMATION
general PowerPAD design considerations
The TLC08x is available in a thermally-enhanced PowerPAD family of packages. These packages are
constructed using a downset leadframe upon which the die is mounted [see Figure 52(a) and Figure 52(b)]. This
arrangement results in the lead frame being exposed as a thermal pad on the underside of the package [see
Figure 52(c)]. Because this thermal pad has direct thermal contact with the die, excellent thermal performance
can be achieved by providing a good thermal path away from the thermal pad.
The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.
During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be
soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,
heat can be conducted away from the package into either a ground plane or other heat dissipating device.
The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of
surface mount with the, heretofore, awkward mechanical methods of heatsinking.
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
NOTE B: The thermal pad is electrically isolated from all terminals in the package.
Figure 52. Views of Thermally Enhanced DGN Package
Although there are many ways to properly heatsink the PowerPAD package, the following steps illustrate the
recommended approach.
68 mils x 70 mils with 5 vias
(Via diameter = 13 mils)
78 mils x 94 mils with 9 vias
(Via diameter = 13 mils)
Thermal Pad Area
Single or Dual
Quad
Figure 53. PowerPAD PCB Etch and Via Pattern
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| TLC083IDGQRG4 | FAMILY OF WIDE BANDWIDTH HIGH OUTPUT DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TLC085IPWPR | 制造商:TI 制造商全稱:Texas Instruments 功能描述:FAMILY OF WIDE BANDWIDTH HIGH OUTPUT DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS |
| TLC085IPWPRG4 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:FAMILY OF WIDE BANDWIDTH HIGH OUTPUT DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS |
| TLC1078 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:LinCMOSE mPOWER PRECISION OPERATIONAL AMPLIFIERS |
| TLC1078CD | 功能描述:運(yùn)算放大器 - 運(yùn)放 Dual Micropower RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| TLC1078CDG4 | 功能描述:運(yùn)算放大器 - 運(yùn)放 Dual Micropower Precision Lo-Voltage RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
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