參數(shù)資料
型號(hào)： TLC075IPWPRG4
廠商： Texas Instruments, Inc.
英文描述： FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS
中文描述： 家庭具有寬帶高輸出驅(qū)動(dòng)單電源運(yùn)算放大器
文件頁(yè)數(shù)： 24/48頁(yè)
文件大?。?/td> 1839K
代理商： TLC075IPWPRG4
SLOS219E JUNE 1999 REVISED SEPTEMBER 2006
24
WWW.TI.COM
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
APPLICATION INFORMATION
general PowerPAD design considerations (continued)
TJ = 150
°
C
4
3
2
0
55 40
10
TA Free-Air Temperature
°
C
20 35
M
5
6
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
7
65
95
125
1
DGN Package
Low-K Test PCB
θ
JA = 52.3
°
C/W
SOT-23 Package
Low-K Test PCB
θ
JA = 324
°
C/W
25
5
50
80
110
PWP Package
Low-K Test PCB
θ
JA = 29.7
°
C/W
SOIC Package
Low-K Test PCB
θ
JA = 176
°
C/W
PDIP Package
Low-K Test PCB
θ
JA = 104
°
C/W
NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.
Figure 53. Maximum Power Dissipation vs Free-Air Temperature
The next consideration is the package constraints. The two sources of heat within an amplifier are quiescent
power and output power. The designer should never forget about the quiescent heat generated within the
device, especially multi-amplifier devices. Because these devices have linear output stages (Class A-B), most
of the heat dissipation is at low output voltages with high output currents.
The other key factor when dealing with power dissipation is how the devices are mounted on the PCB. The
PowerPAD devices are extremely useful for heat dissipation. But, the device should always be soldered to a
copper plane to fully use the heat dissipation properties of the PowerPAD. The SOIC package, on the other
hand, is highly dependent on how it is mounted on the PCB. As more trace and copper area is placed around
the device,
θ
JA
decreases and the heat dissipation capability increases. The currents and voltages shown in
these graphs are for the total package. For the dual or quad amplifier packages, the sum of the RMS output
currents and voltages should be used to choose the proper package.
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