參數(shù)資料
型號: TL05
廠商: Texas Instruments, Inc.
英文描述: ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
中文描述: 增強型場效應(yīng)低失調(diào)運算放大器
文件頁數(shù): 4/65頁
文件大?。?/td> 1022K
代理商: TL05
TL05x, TL05xA, TL05xY
ENHANCED-JFET LOW-OFFSET
OPERATIONAL AMPLIFIERS
SLOS178 – FEBRUARY 1997
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TL051Y chip information
This chip, when properly assembled, displays characteristics similar to the TL051. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
×
4 MILS MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
OUT
IN+
IN–
VCC+
(7)
(3)
(2)
(6)
(1)
(4)
(5)
VCC–
OFFSET N1
OFFSET N2
63
43
(1)
(2)
(3)
(4)
(5)
(6)
(7)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TL051 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
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TL-05-100-52 制造商:Southco 功能描述:
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