參數(shù)資料
型號: TL054Y
廠商: Texas Instruments, Inc.
英文描述: ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
中文描述: 增強型場效應(yīng)低失調(diào)運算放大器
文件頁數(shù): 6/65頁
文件大小: 1022K
代理商: TL054Y
TL05x, TL05xA, TL05xY
ENHANCED-JFET LOW-OFFSET
OPERATIONAL AMPLIFIERS
SLOS178 – FEBRUARY 1997
6
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TL054 chip information
This chip, when properly assembled, displays characteristics similar to the TL054C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. These chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
+
1OUT
1IN+
1IN–
VCC+
(4)
(6)
(3)
(2)
(5)
(1)
+
(7)
2IN+
2IN–
2OUT
(11)
VCC–
+
3OUT
3IN+
3IN–
(13)
(10)
(9)
(12)
(8)
+
(14)
4OUT
4IN+
4IN–
(6)
(7)
(8)
(9)
71
122
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
×
4 MILS MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF THE CHIP.
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)
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