參數(shù)資料
型號: TIBPAL16R8-7MFK
廠商: Texas Instruments, Inc.
英文描述: HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS
中文描述: 高性能影響組E PAL制式電路
文件頁數(shù): 20/30頁
文件大?。?/td> 295K
代理商: TIBPAL16R8-7MFK
TIBPAL16R8-5C
HIGH-PERFORMANCE
IMPACT-X
PAL
CIRCUITS
SRPS011D – D3359, OCTOBER 1989 – REVISED SEPTEMBER 1992
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
20
THERMAL INFORMATION
thermal management of the TIBPAL16R8-5C
Thermal management of the TIBPAL16R8-5CN and TIBPAL16R8-5CFN is necessary when operating at certain
conditions of frequency, output loading, and outputs switching simultaneously. The device and system
application will determine the appropriate level of management.
Determining the level of thermal management is based on factors such as power dissipation (P
D
), ambient
temperature (T
A
), and transverse airflow (FPM). Figures 6 (a) and 6 (b) show the relationship between ambient
temperature and transverse airflow at given power dissipation levels. The required transverse airflow can be
determined at a particular ambient temperature and device power dissipation level in order to ensure the device
specifications.
Figure 7 illustrates how power dissipation varies as a function of frequency and the number of outputs switching
simultaneously. It should be noted that all outputs are fully loaded (C
L
= 50 pF). Since the condition of eight fully
loaded outputs represents the worst-case condition, each application must be evaluated accordingly.
40
20
10
0
0
200
400
600
800
1000
(a) TIBPAL16R8-5CN
60
70
M
MINIMUM TRANSVERSE AIR FLOW
vs
AMBIENT TEMPERATURE
80
50
30
TA – Ambient Temperature –
°
C
PD = 1.6 W
PD = 1.4 W
PD = 1.2 W
PD = 1 W
PD = 0.8 W
PD = 0.6 W
40
20
10
0
0
200
400
600
800
1000
(b) TIBPAL16R8-5CFN
60
70
M
80
50
30
MINIMUM TRANSVERSE AIR FLOW
vs
AMBIENT TEMPERATURE
TA – Ambient Temperature –
°
C
PD = 1.6 W
PD = 1.4 W
PD = 1.2 W
PD = 1 W
PD = 0.8 W
PD = 0.6 W
Figure 6
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