參數(shù)資料
型號(hào): THS7319IZSVT
廠商: Texas Instruments
文件頁(yè)數(shù): 16/33頁(yè)
文件大?。?/td> 0K
描述: IC EDTV VIDEO AMP 3CH 9-UCSP
標(biāo)準(zhǔn)包裝: 1
應(yīng)用: 緩沖器
輸出類型: 滿擺幅
電路數(shù): 3
-3db帶寬: 20MHz
轉(zhuǎn)換速率: 80 V/µs
電流 - 電源: 3.4mA
電流 - 輸出 / 通道: 70mA
電壓 - 電源,單路/雙路(±): 2.5 V ~ 5.5 V
安裝類型: 表面貼裝
封裝/外殼: 9-UltraCSP?(Xcept)
供應(yīng)商設(shè)備封裝: 9-UCSP
包裝: 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁(yè)面: 863 (CN2011-ZH PDF)
其它名稱: 296-24604-6
PRINTED WIRING BOARD (PWB) DESIGN GUIDE
CopperTrace
Width
SolderMaskThickness
SolderPadWidth
SolderMaskOpening
CopperTraceThickness
www.ti.com.............................................................................................................................................................. SBOS468A – JUNE 2009 – REVISED JULY 2009
When designing the pad size for the MicrostarCSP, it
desired land area, and the opening size is defined by
is recommended that the layout use a non-solder
the copper pad width. Figure 53 and Table 2 define
mask defined (NSMD) landing pad. With this method,
the land pattern recommendations. Figure 54 and
Table 3 show a trace width example.
Figure 53. Land Pattern Recommendations
Table 2. Definitions for Figure 53
SOLDER MASK
SOLDER PAD
COPPER PAD
OPENING
STENCIL OPENING
STENCIL THICKNESS
Non-solder mask defined
250
m × 250 m square
200
m to 275 m
Copper pad + 50
m
100
m
(NSMD)
(rounded corners)
Copyright 2009, Texas Instruments Incorporated
23
Product Folder Link(s): THS7319
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