參數(shù)資料
型號(hào)： THS4215DRB
廠商： TEXAS INSTRUMENTS INC
元件分類： 音頻／視頻放大
英文描述： 1 CHANNEL, VIDEO AMPLIFIER, PDSO8
封裝： PLASTIC, MSOP-8
文件頁(yè)數(shù)： 19/40頁(yè)
文件大?。?/td> 1013K
代理商： THS4215DRB
THS4211
THS4215
SLOS400C SEPTEMBER 2002 REVISED JANUARY 2004
www.ti.com
26
Through the use of thermal paths within this copper area,
heat can be conducted away from the package into either
a ground plane or other heat dissipating device.
The PowerPAD package represents a breakthrough in
combining the small area and ease of assembly of surface
mount with the heretofore awkward mechanical methods
of heatsinking.
Figure 89. Views of Thermally Enhanced
Package
DIE
Side View (a)
DIE
End View (b)
Thermal
Pad
Bottom View (c)
Although there are many ways to properly heatsink the
PowerPAD package, the following steps illustrate the
recommended approach.
Figure 90. PowerPAD PCB Etch and Via
Pattern
Single or Dual
68 Mils x 70 Mils
(Via Diameter = 13 Mils)
PowerPAD PCB LAYOUT CONSIDERATIONS
1.
Prepare the PCB with a top side etch pattern as shown
in Figure 90. There should be etching for the leads as
well as etch for the thermal pad.
2.
Place five holes in the area of the thermal pad. These
holes should be 13 mils in diameter. Keep them small
so that solder wicking through the holes is not a
problem during reflow.
3.
Additional vias may be placed anywhere along the
thermal plane outside of the thermal pad area. They
help dissipate the heat generated by the THS4211 and
THS4215 IC. These additional vias may be larger than
the 13-mil diameter vias directly under the thermal
pad. They can be larger because they are not in the
thermal pad area to be soldered, so wicking is not a
problem.
4.
Connect all holes to the internal ground plane.
5.
When connecting these holes to the ground plane, do
not use the typical web or spoke via connection
methodology. Web connections have a high thermal
resistance connection that is useful for slowing the
heat transfer during soldering operations. This
resistance makes the soldering of vias that have
plane connections easier. In this application, however,
low thermal resistance is desired for the most efficient
heat transfer. Therefore, the holes under the THS4211
and THS4215 PowerPAD package should make their
connection to the internal ground plane, with a
complete connection around the entire circumference
of the plated-through hole.
6.
The top-side solder mask should leave the terminals
of the package and the thermal pad area with its five
holes exposed. The bottom-side solder mask should
cover the five holes of the thermal pad area. This
prevents solder from being pulled away from the
thermal pad area during the reflow process.
7.
Apply solder paste to the exposed thermal pad area
and all of the IC terminals.
8.
With these preparatory steps in place, the IC is simply
placed in position and run through the solder reflow
operation
as
any
standard
surface-mount
component. This results in a part that is properly
installed.
For a given
θJA , the maximum power dissipation is shown
in Figure 91 and is calculated by the equation 5:
P
D +
Tmax
* T
A
q
JA
where
PD = Maximum power dissipation of THS4211 (watts)
TMAX = Absolute maximum junction temperature (150°C)
TA = Free-ambient temperature (°C)
θJA = θJC + θCA
θJC = Thermal coefficient from junction to the case
θCA = Thermal coefficient from the case to ambient air
(
°C/W).
The next consideration is the package constraints. The
two sources of heat within an amplifier are quiescent
power and output power. The designer should never forget
about the quiescent heat generated within the device,
especially multi-amplifier devices. Because these devices
have linear output stages (Class AB), most of the heat
dissipation is at low output voltages with high output
currents.
The other key factor when dealing with power dissipation
is how the devices are mounted on the PCB. The
PowerPAD devices are extremely useful for heat
dissipation. But, the device should always be soldered to
a copper plane to fully use the heat dissipation properties
of the PowerPAD. The SOIC package, on the other hand,
is highly dependent on how it is mounted on the PCB. As
more trace and copper area is placed around the device,
θJA decreases and the heat dissipation capability
(6)
相關(guān)PDF資料
PDF描述
THS4215DG4 1 CHANNEL, VIDEO AMPLIFIER, PDSO8
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THS4215DRBR 1 CHANNEL, VIDEO AMPLIFIER, PDSO8
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THS4215DRBRG4 功能描述:高速運(yùn)算放大器 Super-Fast Ultr-Lo- Distortion Hi-Speed RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
THS4215DRBT 功能描述:高速運(yùn)算放大器 Super-Fast Ultr-Lo- Distortion Hi-Speed RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
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THS4215DRG4 功能描述:高速運(yùn)算放大器 Super-Fast Ultr-Lo- Distortion Hi-Speed RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
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