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參數(shù)資料
| 型號(hào)： | THS4022D |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | 350-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| 中文描述： | 350 - MHz的低噪聲高速放大器 |
| 文件頁(yè)數(shù)： | 16/22頁(yè) |
| 文件大小： | 366K |
| 代理商： | THS4022D |
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THS4021, THS4022
350-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS
SLOS265B – SEPTEMBER 1999 – REVISED FEBRUARY 2000
16
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
general PowerPAD design considerations (continued)
The actual thermal performance achieved with the THS402xDGN in its PowerPAD package depends on the
application. In the example above, if the size of the internal ground plane is approximately 3 inches
×
3 inches,
then the expected thermal coefficient,
θ
JA
,
is
about 58.4 C/W. For comparison, the non-PowerPAD version of
the THS402x IC (SOIC) is shown. For a given
θ
JA
, the maximum power dissipation is shown in Figure 39 and
is calculated by the following formula:
PD
TMAX–TA
JA
Where:
P
D
T
MAX
= Absolute maximum junction temperature (150
°
C)
T
A
= Free-ambient air temperature (
°
C)
θ
JA
=
θ
JC
+
θ
CA
θ
JC
= Thermal coefficient from junction to case
θ
CA
= Thermal coefficient from case to ambient air (
°
C/W)
= Maximum power dissipation of THS402x IC (watts)
DGN Package
θ
JA = 58.4
°
C/W
2 oz. Trace And Copper Pad
With Solder
DGN Package
θ
JA = 158
°
C/W
2 oz. Trace And
Copper Pad
Without Solder
SOIC Package
High-K Test PCB
θ
JA = 98
°
C/W
TJ = 150
°
C
SOIC Package
Low-K Test PCB
θ
JA = 167
°
C/W
2
1.5
1
0
–40
–20
0
20
40
M
2.5
3
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
3.5
60
80
100
0.5
TA – Free-Air Temperature –
°
C
NOTE A: Results are with no air flow and PCB size = 3”
×
3”
Figure 39. Maximum Power Dissipation vs Free-Air Temperature
More complete details of the PowerPAD installation process and thermal management techniques can be found
in the Texas Instruments Technical Brief, PowerPAD Thermally Enhanced Package.This document can be
found at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also be
ordered through your local TI sales office. Refer to literature number SLMA002 when ordering.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| THS4022DGN | 350-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| THS4022EVM | 350-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| THS4031D | 100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| THS4031JG | 100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| THS4031DGN | 100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| THS4022DGN | 制造商:TI 制造商全稱:Texas Instruments 功能描述:350-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| THS4022EVM | 功能描述:放大器 IC 開(kāi)發(fā)工具 THS4022 Hi-Spd Amp Eval Mod RoHS:否 制造商:International Rectifier 產(chǎn)品:Demonstration Boards 類型:Power Amplifiers 工具用于評(píng)估:IR4302 工作電源電壓:13 V to 23 V |
| THS4022ID | 功能描述:高速運(yùn)算放大器 Dual 350MHz RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS4022IDG4 | 功能描述:高速運(yùn)算放大器 Dual 350MHz RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS4022IDGN | 功能描述:高速運(yùn)算放大器 350-MHz Low-Noise Vltg-Feedback Dual RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
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