參數(shù)資料
型號： THS4012DGN
廠商： Texas Instruments, Inc.
英文描述： 290-MHz LOW-DISTORTION HIGH-SPEED AMPLIFIERS
中文描述： 290 - MHz的低失真高速放大器
文件頁數(shù)： 23/30頁
文件大?。?/td> 439K
代理商： THS4012DGN
THS4011, THS4012
290-MHz LOW-DISTORTION HIGH-SPEED AMPLIFIERS
SLOS216B – JUNE 1999 – FEBRUARY 2000
23
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
general PowerPAD design considerations (continued)
The next consideration is the package constraints. The two sources of heat within an amplifier are quiescent
power and output power. The designer should never forget about the quiescent heat generated within the
device, especially muti-amplifier devices. Because these devices have linear output stages (Class A-B), most
of the heat dissipation is at low output voltages with high output currents. Figure 36 to Figure 39 show this effect,
along with the quiescent heat, with an ambient air temperature of 50
°
C. When using V
CC
=
±
5 V, there is
generally not a heat problem, even with SOIC packages. But, when using V
CC
=
±
15 V, the SOIC package is
severely limited in the amount of heat it can dissipate. The other key factor when looking at these graphs is how
the devices are mounted on the PCB. The PowerPAD devices are extremely useful for heat dissipation. But,
the device should always be soldered to a copper plane to fully use the heat dissipation properties of the
PowerPAD. The SOIC package, on the other hand, is highly dependent on how it is mounted on the PCB. As
more trace and copper area is placed around the device,
θ
JA
decreases and the heat dissipation capability
increases. The currents and voltages shown in these graphs are for the total package. For the dual amplifier
package (THS4012), the sum of the RMS output currents and voltages should be used to choose the proper
package.
Figure 36
Package With
θ
JA < = 120
°
C/W
SO-8 Package
θ
JA = 167
°
C/W
Low-K Test PCB
VCC =
±
5 V
Tj = 150
°
C
TA = 50
°
C
100
80
40
0
0
1
| VO | – RMS Output Voltage – V
2
3
–
I
|
140
180
200
4
5
160
120
60
20
|
Maximum Output
Current Limit Line
THS4011
MAXIMUM RMS OUTPUT CURRENT
vs
RMS OUTPUT VOLTAGE DUE TO THERMAL LIMITS
Safe Operating
Area
Figure 37
100
10
0
3
| VO | – RMS Output Voltage – V
6
9
1000
12
15
Maximum Output
Current Limit Line
SO-8 Package
θ
JA = 167
°
C/W
Low-K Test PCB
SO-8 Package
θ
JA = 98
°
C/W
High-K Test PCB
TJ = 150
°
C
TA = 50
°
C
–
IO
|
|
VCC =
±
15 V
DGN Package
θ
JA = 58.4
°
C/W
THS4011
MAXIMUM RMS OUTPUT CURRENT
vs
RMS OUTPUT VOLTAGE DUE TO THERMAL LIMITS
Safe Operating
Area
相關PDF資料
PDF描述
THS4012EVM 290-MHz LOW-DISTORTION HIGH-SPEED AMPLIFIERS
THS4021D 350-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS
THS4021DGN 350-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS
THS4021EVM 350-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS
THS4022D 350-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS
相關代理商/技術參數(shù)
參數(shù)描述
THS4012EVM 功能描述:放大器 IC 開發(fā)工具 THS4012 Hi-Spd Amp Eval Mod RoHS:否 制造商:International Rectifier 產(chǎn)品:Demonstration Boards 類型:Power Amplifiers 工具用于評估:IR4302 工作電源電壓:13 V to 23 V
THS4012ID 功能描述:高速運算放大器 Dual 290MHz RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
THS4012IDG4 功能描述:高速運算放大器 Dual 290MHz RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
THS4012IDGN 功能描述:高速運算放大器 Dual 290MHz RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
THS4012IDGNG4 功能描述:高速運算放大器 290-MHz Dual Lo-Dist Voltage-Feedback RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
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