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參數(shù)資料
| 型號： | TFP510PAP |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 消費家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PQFP64 |
| 封裝： | 10 X 10 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, HTQFP-64 |
| 文件頁數(shù)： | 17/27頁 |
| 文件大?。?/td> | 383K |
| 代理商： | TFP510PAP |
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TFP510
TI PanelBus DIGITAL TRANSMITTER
SLDS146B JANUARY 2002 REVISED DECEMBER 2002
24
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TI 64-pin TQFP PowerPAD package
The TFP510 is available in TI’s thermally enhanced 64-pin TQFP PowerPAD package. The PowerPAD package
is a 10-mm
× 10-mm × 1,0-mm TQFP outline with 0,5-mm lead-pitch. The PowerPAD package has a specially
designed die mount pad that offers improved thermal capability over typical TQFP packages of the same outline.
The TI 64-pin TQFP PowerPAD package offers a backside solder plane that connects directly to the die mount
pad for enhanced thermal conduction. For thermal considerations, soldering the backside of the TFP510 to the
application board is not required because the device power dissipation is well within the package capability
when not soldered.
Soldering the backside of the device to the PCB ground plane is recommended for electrical considerations.
Because the die pad is electrically connected to the chip substrate and hence to chip ground, connecting the
back side of the PowerPAD package to a PCG ground plane provides a low-inductance, low-impedance
connection to help improve EMI, ground bounce, and power-supply noise performance.
Table 2 contains the thermal properties of the TI 64-pin TQFP PowerPAD package. The 64-pin TQFP
non-PowerPAD package is included only for reference.
Table 2. TI 64-Pin TQFP (10
× 10 × 1,0 mm)/0,5 mm Lead-Pitch
PARAMETER
WITHOUT
PowerPAD
PowerPAD
NOT CONNECTED TO
PCB THERMAL PLANE
PowerPAD
CONNECTED TO PCB
THERMAL PLANE
(see Note 14)
RθJA
Thermal resistance, junction-to-ambient
(see Notes 13 and 14)
75.83
°C/W
42.20
°C/W
21.47
°C/W
RθJC Thermal resistance, junction-to-case (see Notes 13 and 14)
7.80
°/W
0.38
°C/W
0.38
°C/W
PD
Power handling capabilities of package (see Notes 13, 14,
and 15)
0.92 W
1.66 W
3.26 W
NOTES: 13. Specified with the bond pad on the backside of the PowerPAD package soldered to a 2-oz. Cu plate PCB thermal plane
14. Airflow is at 0 LFM (no airflow).
15. Specified at 150
°C junction temperature and 80°C ambient temperature
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