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參數(shù)資料
| 型號： | TFP401APZPG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 消費(fèi)家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PQFP100 |
| 封裝： | 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, HTQFP-100 |
| 文件頁數(shù)： | 8/20頁 |
| 文件大?。?/td> | 295K |
| 代理商： | TFP401APZPG4 |
TFP401, TFP401A
TI
PanelBus DIGITAL RECEIVER
SLDS120C - MARCH 2000 REVISED MAY 2011
16
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TI PowerPAD 100-TQFP package
The TFP401/401A is packaged in TI’s thermally enhanced PowerPAD 100TQFP packaging. The PowerPAD
package is a 14 mm × 14 mm × 1 mm TQFP outline with 0.5 mm lead-pitch. The PowerPAD package has a
specially designed die mount pad that offers improved thermal capability over typical TQFP packages of the
same outline. The TI 100-TQFP PowerPAD package offers a back-side solder plane that connects directly
to the die mount pad for enhanced thermal conduction. Soldering the back side of the TFP401/401A to the
application board is not required thermally as the device power dissipation is well within the package capability
when not soldered.
Soldering the back side of the device to the PCB ground plane is recommended for electrical considerations.
Since the die pad is electrically connected to the chip substrate and hence chip ground, connection of the
PowerPAD back side to a PCB ground plane will help to improve EMI, ground bounce, and power supply noise
performance.
Table 1 outlines the thermal properties of the TI 100-TQFP PowerPAD package. The 100-TQFP non-
PowerPAD package is included only for reference.
Table 1. TI 100-TQFP (14 × 14 × 1 mm)/0.5 mm Lead Pitch
PARAMETER
WITHOUT
PowerPAD
NOT CONNECTED TO PCB
THERMAL PLANE
PowerPAD
CONNECTED TO PCB
THERMAL PLANE
Theta-JA,
45°C/W
27.3°C/W
17.3°C/W
Theta-JC,
3.11°C/W
0.12°C/W
Maximum power dissipation,,§
1.6 W
2.7 W
4.3 W
Specified with 2 oz. Cu PCB plating.
Airflow is at 0 LFM (no airflow)
§ Measured at ambient temperature, TA = 70°C.
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相關(guān)代理商/技術(shù)參數(shù) |
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| TFP401PZP | 功能描述:顯示接口集成電路 PanelBus DVI Receiver 165MHz RoHS:否 制造商:Texas Instruments 電源電流:125 mA 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:WQFN-60 封裝:Reel |
| TFP401PZPG4 | 功能描述:顯示接口集成電路 PanelBus DVI Rcvr RoHS:否 制造商:Texas Instruments 電源電流:125 mA 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:WQFN-60 封裝:Reel |
| TFP403 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:TI PANEBUS DIGITAL RECEIVER |
| TFP403PZP | 功能描述:顯示接口集成電路 PanelBus DVI Receiver RoHS:否 制造商:Texas Instruments 電源電流:125 mA 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:WQFN-60 封裝:Reel |
| TFP403PZPG4 | 功能描述:顯示接口集成電路 PanelBus DVI Rcvr RoHS:否 制造商:Texas Instruments 電源電流:125 mA 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:WQFN-60 封裝:Reel |
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