參數(shù)資料
型號： TEF6701HL
廠商： NXP SEMICONDUCTORS
元件分類： 接收器
英文描述： Car radio tuner front-end for digital IF
中文描述： AM/FM, AUDIO SINGLE CHIP RECEIVER, PQFP64
封裝： 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64
文件頁數(shù)： 50/55頁
文件大?。?/td> 318K
代理商： TEF6701HL
9397 750 13471
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 — 16 November 2004
50 of 55
Philips Semiconductors
TEF6701HL
Car radio tuner front-end for digital IF
17. Soldering
17.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
17.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215
°
C to 270
°
C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
below 225
°
C (SnPb process) or below 245
°
C (Pb-free process)
–
for all BGA, HTSSON..T and SSOP..T packages
–
for packages with a thickness
≥
2.5 mm
–
for packages with a thickness < 2.5 mm and a volume
≥
350 mm
3
so called
thick/large packages.
below 240
°
C (SnPb process) or below 260
°
C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
17.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TEF6721HL 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Car radio tuner front-end for digital IF
TEF6721HL/V1 功能描述:調(diào)諧器 DIGITAL IF TUNER IC RoHS:否 制造商:NXP Semiconductors 功能: 噪聲系數(shù): 工作電源電壓: 最小工作溫度: 最大工作溫度:
TEF6721HL/V1,518 功能描述:調(diào)諧器 DIGITAL IF TUNER IC RoHS:否 制造商:NXP Semiconductors 功能: 噪聲系數(shù): 工作電源電壓: 最小工作溫度: 最大工作溫度:
TEF6721HL/V1,557 功能描述:調(diào)諧器 DIGITAL IF TUNER IC RoHS:否 制造商:NXP Semiconductors 功能: 噪聲系數(shù): 工作電源電壓: 最小工作溫度: 最大工作溫度:
TEF6721HL/V1S,518 功能描述:調(diào)諧器 CAR RADIO TUNER FRNT END FOR DIGITAL IF RoHS:否 制造商:NXP Semiconductors 功能: 噪聲系數(shù): 工作電源電壓: 最小工作溫度: 最大工作溫度:
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