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參數(shù)資料
| 型號(hào)： | TEA5766UK/N1,023 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 接收器 |
| 英文描述： | FM, AUDIO SINGLE CHIP RECEIVER, PBGA25 |
| 封裝： | 3.30 X 3.25 MM, 0.60 MM HEIGHT, WLCSP-25 |
| 文件頁數(shù)： | 51/59頁 |
| 文件大?。?/td> | 273K |
| 代理商： | TEA5766UK/N1,023 |
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TEA5766UK_1
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 22 March 2007
55 of 59
NXP Semiconductors
TEA5766UK
Stereo FM radio + RDS
16.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and ux residues
and/or underll removed. When a new chip is placed on the substrate, use the ux
process instead of solder on the solder lands. Apply ux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reow the solder, use the solder prole shown in
Application Note
AN10365 “Surface mount reow soldering description”.
16.3.4 Cleaning
Cleaning can be done after reow soldering.
17. References
[1]
The I2C-bus specication — version 2.1, January 2000.
[2]
BS EN 62106 — Specication of the radio data system (RDS) for VHF/FM sound
broadcasting in the frequency range from 87.5 to 108 MHz, 2001.
[3]
Data sheet TEF6892H — Car radio integrated signal processor, 2003 Oct 21.
[4]
JESD22-C101C — JEDEC standard for charged-device model ESD test method.
[5]
Data sheet SAA6588 — RDS/RBDS pre-processor, 2002 Jan 14.
[6]
EN 55020 — Sound and television broadcast receivers and associated
equipment-Immunity characteristics- Limits and methods of measurement, May
2002.
[7]
RDS: The Radio Data System — Dietmar Kopitz and Bev Marks.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TEA5766UK/N1,118 | FM, AUDIO SINGLE CHIP RECEIVER, PBGA25 |
| TEA5766UK/N1/S21,0 | FM, AUDIO SINGLE CHIP RECEIVER, PBGA25 |
| TEA5766UK/N1/S21,1 | FM, AUDIO SINGLE CHIP RECEIVER, PBGA25 |
| TEA5766UK | FM, AUDIO SINGLE CHIP RECEIVER, PBGA25 |
| TEA5777HL/N2,118 | AM/FM, AUDIO SINGLE CHIP RECEIVER, PQFP32 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TEA5767 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:single-chip FM stereo radio |
| TEA5767HL | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Low-power FM stereo radio for handheld applications |
| TEA5767HN | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Low-power FM stereo radio for handheld applications |
| TEA5767HN/V3 | 功能描述:射頻收發(fā)器 FM RECEIVER RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| TEA5767HN/V3,118 | 功能描述:射頻收發(fā)器 FM RECEIVER RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
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