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參數(shù)資料
| 型號： | TDF3A-1907E-21A-01P |
| 廠商： | TOKO INC |
| 英文描述： | 1907 MHz, DIELECTRIC BPF |
| 封裝： | ROHS COMPLIANT PACKAGE |
| 文件頁數(shù)： | 4/4頁 |
| 文件大?。?/td> | 189K |
| 代理商： | TDF3A-1907E-21A-01P |
1. Reflow solder conditions
Solderability
When flux-mounted terminals are immersed in
solder at following conditions, at least 95% of the
surface should be covered by solder.
Conditins
leaded process : 230±5°C for 3±0.5 seconds
lead free process : 260±5°C for 3±0.5 seconds
Solder heat resistance
No abnomalities under solder conditions of
leaded process : 230±5°C for 5 seconds
lead free process : 260±5°C for 5 seconds
2. Rinsing
After Soldering, you should rinsing away the
excess flux. Any commercially available rinsing
agent may be used.
3. Other Precautions
Perform soldering at as low a temperature as
possible and for as short a time as possible.
Make sure that the silver electrode of resonators is
not covered by solder.
Avoid applying external forces to terminals such as
by bending or cutting them.
4. Iron Soldering
Perform iron soldering with iron at following
conditions.
Conditins
leaded process : 350±5°C for 5s. Max.
lead free process : 390±5°C for 5s. Max.
Temperature profile (land seface temperature)
(
)
*1
*2
*3
*4
230
150
180
190
210
260
150
180
220
240
*1
*2
*3
*4
for lead free process
for leaded process
Pre-heat conditions
*1 150 160
60s. Max.
*1 150 160
60
Reflow conditions
*2 160
Min. 45s. Max.
*2 160
45
*3 200
Min. 30s. Max.
*3 200
30
*4 230±5
5s. Max.
*4 230±5
5
Pre-heat conditions
*1 150 180
120s. Max.
*1 150 180
120
Reflow conditions
*2 180
Min. 150s. Max.
*2 180
150
*3 230
Min. 40s. Max.
*3 230
40
*4 255±5
5s. Max.
*4 255±5
5
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