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參數(shù)資料
| 型號(hào)： | TDA8768BH/5/C3 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | ADC |
| 英文描述： | 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP44 |
| 封裝： | 10 X 10 MM, 1.75 MM HEIGHT, 1.30 MM LEAD LENGTH, PLASTIC, SOT-307-2, QFP-44 |
| 文件頁數(shù)： | 20/30頁 |
| 文件大?。?/td> | 547K |
| 代理商： | TDA8768BH/5/C3 |
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Philips Semiconductors
TDA8768B
12-bit, 80 Msps Analog-to-Digital Converter (ADC)
Product data
Rev. 02 — 20 January 2004
27 of 30
9397 750 12338
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[1]
For more detailed information on the BGA packages refer to the
(LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales ofce.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods.
[3]
These transparent plastic packages are extremely sensitive to reow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reow
soldering with peak temperature exceeding 217
°C ± 10 °C measured in the atmosphere of the reow
oven. The package body peak temperature must be kept as low as possible.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on ex foil. However, the image sensor package can be mounted by the client on a ex
foil by using a hot bar soldering process. The appropriate soldering prole can be provided on
request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
LQFP, QFP, TQFP
not recommended[5][6]
suitable
SSOP, TSSOP, VSO, VSSOP
not recommended[7]
suitable
not suitable
Table 10:
Suitability of surface mount IC packages for wave and reow soldering
methods…continued
Package[1]
Soldering method
Wave
Reow[2]
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