參數(shù)資料
型號： TDA19977BHV/15/C1
廠商： NXP SEMICONDUCTORS
元件分類： 消費家電
英文描述： SPECIALTY CONSUMER CIRCUIT, PQFP144
封裝： 20 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, SOT612-3, HLQFP-144
文件頁數(shù)： 26/40頁
文件大?。?/td> 181K
代理商： TDA19977BHV/15/C1
TDA19977A_TDA19977B_1
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 7 August 2008
32 of 40
NXP Semiconductors
TDA19977A; TDA19977B
Triple input HDMI receiver interface with digital processing
17. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reow
soldering description”.
17.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for ne pitch SMDs. Reow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
17.2 Wave and reow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature prole. Leaded packages,
packages with solder balls, and leadless packages are all reow solderable.
Key characteristics in both wave and reow soldering are:
Board specications, including the board nish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
17.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
相關(guān)PDF資料
PDF描述
TDA2003-TA5-T 12 W, 1 CHANNEL, AUDIO AMPLIFIER, SFM5
TDA2003-TB5-T 12 W, 1 CHANNEL, AUDIO AMPLIFIER, ZFM5
TDA2003G-TA5-T 12 W, 1 CHANNEL, AUDIO AMPLIFIER, SFM5
TDA2003G-TB5-T 12 W, 1 CHANNEL, AUDIO AMPLIFIER, ZFM5
TDA2003L-TA5-T 12 W, 1 CHANNEL, AUDIO AMPLIFIER, SFM5
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TDA19978A 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Quad HDMI 1.3a receiver interface with equalizer (HDTV up to 1080p, up to UXGA for PC formats)
TDA19978AHV 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Quad HDMI 1.3a receiver interface with equalizer (HDTV up to 1080p, up to UXGA for PC formats)
TDA19978AHV/15,518 功能描述:視頻 IC IC SMART CARD INTF RoHS:否 制造商:Fairchild Semiconductor 工作電源電壓:5 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-28 封裝:Reel
TDA19978AHV/15,551 制造商:NXP Semiconductors 功能描述:TDA19978AHV/HLQFP144/TRAYBDP//15/C182 - Trays
TDA19978AHV/15,557 功能描述:視頻 IC IC SMART CARD INTF RoHS:否 制造商:Fairchild Semiconductor 工作電源電壓:5 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-28 封裝:Reel
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