參數(shù)資料
型號: TC5E-040.0M
廠商: CONNOR WINFIELD CORP
元件分類: XO, clock
英文描述: TCXO, CLOCK, 40 MHz, HCMOS OUTPUT
封裝: ROHS COMPLIANT, MINIATURE, CERAMIC, SMD, 10 PIN
文件頁數(shù): 4/4頁
文件大?。?/td> 204K
代理商: TC5E-040.0M
Table 13.0
Package
Ceramic Surface Mount Package.
2111 Comprehensive Drive
Aurora, Illinois 60505
Phone: 630-851-4722
Fax: 630-851-5040
www.conwin.com
US Headquarters:
630-851-4722
European Headquarters:
+353-61-472221
Bulletin
Page
Revision
Date
Tx180
4of4
07
28 Aug 2009
Specifications subject to change without notice. All dimensions in inches. Copyright 2008 The Connor-Winfield Corporation
120°C
150°C
180°C
260°C
0
220°C
360 Sec. Max.
120 S
Max.
10 S
60 S
Max.
Time
Temperature
260°C
90%
50%
10%
200 mV/Div
0
Design Recommendations
1
Tape and Reel Specifications
OSC
TOP LAYER
GROUND LAYER
BOTTOM LAYER
Output
Buffer
50 Ohm Trace
Without
Vias
.......
Model TA5C-020.0MHz
Typical Phase Noise
Solder Profile
LVCMOS Output Waveform
Clipped Sinewave Output Waveform
Package Characteristics
Environmental Characteristics
Table 14.0
Vibration:
Vibration per Mil Std 883E Method 2007.3 Test Condition A
Shock:
Mechanical Shock per Mil Std 883E Method 2002.4 Test Condition B.
Soldering:
SMD product suitable for Convection Reflow soldering. Peak
temperature 260
°C. Maximum time above 220°C, 60 seconds.
Solderability
Solderability per Mil Std 883E Method 2003
Suggested Pad Layout
Vcc, should have
a large copper
area for reduced
inductance.
Connect a 0.01uF
bypass capacitor
<0.1”(2.54mm)
from the pad.
Ground,
should have
a large copper
area for reduced
inductance.
0.010”(0.254mm)
Recommended
clearance
inductance
for internal
copper flood.
Top View
1
3
4
5
6
8
9
10
Buffer
Ground
50 Ohm trace
<1”by design
Vcc
Ground
Top View
0.215
(5.46mm)
0.037
(0.94mm)
0.051
(1.28mm)
0.051
(1.28mm)
0.295
(7.49mm)
0.030
(0.76mm)
Keep Out Area
Top View
1
Dimensional Tolerance:
±.005 (.127mm)
±.02 (.508mm)
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