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2005 Microchip Technology Inc.
DS21333B-page 3
TC1302A/B
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings
V
DD
...................................................................................6.5V
Maximum Voltage on Any Pin ...... (V
SS
– 0.3) to (V
IN
+ 0.3)V
Power Dissipation ..........................Internally Limited
(Note 7)
Storage temperature .....................................-65°C to +150°C
Maximum Junction Temperature, T
J
...........................+150°C
Continuous Operating Temperature Range ..-40°C to +125°C
ESD protection on all pins, HBM, MM
.....................
4 kV, 400V
Notice:
Stresses above those listed under “Maximum Rat-
ings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Expo-
sure to maximum rating conditions for extended periods may
affect device reliability.
DC CHARACTERISTICS
Electrical Specifications:
Unless otherwise noted, V
IN
= V
R
+1V, I
OUT1
=
I
OUT2
= 100 μA, C
IN
= 4.7 μF,
C
OUT1
= C
OUT2
= 1 μF, C
BYPASS
= 10 nF, SHDN > V
IH
, T
A
= +25°C.
Boldface
type specifications apply for junction temperatures of -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input Operating Voltage
Maximum Output Current
Maximum Output Current
Output Voltage Tolerance
(V
OUT1
and V
OUT2
)
Temperature Coefficient
(V
OUT1
and V
OUT2
)
Line Regulation
(V
OUT1
and V
OUT2
)
Load Regulation, V
OUT
≥
2.5V
(V
OUT1
and V
OUT2
)
Load Regulation, V
OUT
< 2.5V
(V
OUT1
and V
OUT2
)
Thermal Regulation
Dropout Voltage (Note 6)
V
OUT1
> 2.7V
V
OUT2
> 2.6V
Supply Current
TC1302A
TC1302B
V
IN
2.7
300
150
—
—
—
6.0
—
—
V
Note 1
V
IN
= 2.7V to 6.0V
(Note 1)
V
IN
= 2.7V to 6.0V
(Note 1)
Note 2
I
OUT1Max
I
OUT2Max
V
OUT
mA
mA
%
V
R
– 2.5
V
R
±0.5
V
R
+ 2.5
TCV
OUT
—
25
—
ppm/°C
Note 3
Δ
V
OUT
/
Δ
V
IN
—
0.02
0.2
%/V
(V
R
+ 1V)
≤
V
IN
≤
6V
Δ
V
OUT
/
V
OUT
Δ
V
OUT
/
V
OUT
Δ
V
OUT
/
Δ
P
D
-1
0.1
+1
%
I
OUTX
= 0.1 mA to I
OUTMax
,
(Note 4)
-1.5
0.1
+1.5
%
I
OUTX
= 0.1 mA to I
OUTMax
,
(Note 4)
—
0.04
—
%/W
Note 5
V
IN
– V
OUT
V
IN
– V
OUT
—
—
104
150
180
250
mV
mV
I
OUT1
= 300 mA
I
OUT2
= 150 mA
I
IN(A)
I
IN(B)
—
—
103
114
180
180
μA
μA
SHDN2 = V
IN
, I
OUT1
= I
OUT2
= 0 mA
SHDN1 = SHDN2 = V
IN
,
I
OUT1
= I
OUT2
= 0 mA
Note
1:
2:
3:
4:
The minimum V
IN
has to meet two conditions: V
IN
≥
2.7V and V
IN
≥
V
R
+ V
DROPOUT
.
V
R
is defined as the higher of the two regulator nominal output voltages (V
OUT1
or V
OUT2
).
TCV
OUT
= ((V
OUTmax
- V
OUTmin
) * 10
6
)/(V
OUT
*
Δ
T).
Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
Thermal regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to I
LMAX
at V
IN
= 6V for t = 10 msec.
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
value measured at a 1V differential.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., T
A
, T
J
,
θ
JA
). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown.
5:
6:
7: