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參數(shù)資料
| 型號： | TC1173-5.0VUA |
| 廠商： | TelCom Semiconductor, Inc. |
| 英文描述： | 300mA CMOS LDO with Shutdown, ERROR Output and Bypass |
| 中文描述： | 300mA的CMOS LDO穩(wěn)壓器，帶有關(guān)斷，錯誤輸出和旁路 |
| 文件頁數(shù)： | 4/7頁 |
| 文件大?。?/td> | 54K |
| 代理商： | TC1173-5.0VUA |
4
TC1173
300mA CMOS LDO With Shutdown,
ERROR Output, And Bypass
TC1173-2 2/2/00
Bypass Input
A 470pF capacitor connected from the Bypass input to
ground reduces noise present on the internal reference,
which in turn significantly reduces output noise. If output
noise is not a concern, this input may be left unconnected.
Larger capacitor values may be used, but results in a longer
time period to rated output voltage when power is initially
applied.
Thermal Considerations
Thermal Shutdown
Integrated thermal protection circuitry shuts the regula-
tor off when die temperature exceeds 150
°
C. The regulator
remains off until the die temperature drops to approximately
140
°
C.
Power Dissipation
The amount of power the regulator dissipates is prima-
rily a function of input and output voltage, and output current.
The following equation is used to calculate worst case
actual
power dissipation:
P
D
≈
(V
IN
MAX
– V
OUT
MIN
)I
LOAD
MAX
Where:
P
D
= worst case actual power dissipation
V
IN
MAX
= maximum voltage on V
IN
V
OUT
MIN
= minimum regulator output voltage
I
LOAD
MAX
= maximum output (load) current
Equation 1.
The maximum
allowable
power dissipation (Equation 2)
is a function of the maximum ambient temperature (T
A
MAX
),
the maximum allowable die temperature (125
°
C), and the
thermal resistance from junction-to-air (
JA
). The 8-Pin
SOIC package has a
while the 8-Pin MSOP package has a
JA
of approximately
200
°
C/Watt
; both when mounted on a single layer FR4
dielectric copper clad PC board.
JA
of approximately
160
°
C/Watt
,
P
DMAX
= (T
JMAX
– T
AMAX
)
JA
Where all terms are previously defined.
Equation 2.
Equation 1 can be used in conjunction with Equation 2
to ensure regulator thermal operation is within limits. For
example:
GIVEN:
V
IN
MAX
= 3.0V
±
10%
V
OUT
MIN
= 2.7V
±
0.5%
I
LOADMAX
= 250mA
T
J
MAX
= 125
°
C
T
A
MAX
= 55
°
C
JA
= 200
°
C/W
8-Pin MSOP Package
FIND:
1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
P
D
≈
(V
IN
MAX
- V
OUT
MIN
)I
LOAD
MAX
= [(3.0 x 1.1) - (2.7 x .995)]250 x 10
-3
= 155mW
Maximum allowable power dissipation:
P
D
≈
(T
JMAX
– T
AMAX
)
JA
= (125 – 55)
200
= 350mW
In this example, the TC1173 dissipates a maximum of
only 155mW; far below the allowable limit of 350mW. In a
similar manner, Equation 1 and Equation 2 can be used to
calculate maximum current and/or input voltage limits. For
example, the maximum allowable V
IN
is found by substitut-
ing the maximum allowable power dissipation of 350mW
into Equation 1, from which V
IN
MAX
= 4.1V.
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a ground
plane, wide traces at the pads, and wide power supply bus
lines combine to lower
maximum allowable power dissipation limit.
JA
and, therefore, increase the
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